Datasheet

2Maxim Integrated
MAX11321–MAX11328
1Msps, 10-/12-Bit, 4-/8-/16-Channel ADCs with
Post-Mux External Signal Conditioning Access
V
DD
to GND .............................................................-0.3V to +4V
AOP, AON, AIP, AIN, OVDD, AIN0–AIN13, CNVST/AIN14, REF+,
REF-/AIN15 to GND
....................................... -0.3V to the lower of
(V
DD
+ 0.3V) and +4V
CS, SCLK, DIN, DOUT, EOC TO GND
.......-0.3V to the lower of
(V
OVDD
+ 0.3V) and +4V
DGND to GND
...................................................... -0.3V to +0.3V
Input/Output Current (all pins)
...........................................50mA
Continuous Power Dissipation (T
A
= +70NC)
TQFN (derate 34.4mW/NC above +70NC)..................2758mW
Operating Temperature Range
........................ -40NC to +125NC
Junction Temperature
.....................................................+150NC
Storage Temperature Range
............................ -65NC to +150NC
Lead Temperature (soldering, 10s)
................................+300NC
Soldering Temperature (reflow)
......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ........... 29NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............1.7NC/W
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS (MAX11322/MAX11325/MAX11328)
(V
DD
= 2.35V to 3.6V, V
OVDD
= 1.5V to 3.6V, f
SAMPLE
= 1Msps, f
SCLK
= 16MHz, 50% duty cycle, V
REF+
= V
DD
, T
A
= -40NC to +125NC,
unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC ACCURACY (Notes 3 and 4)
Resolution RES 12 bit 12 Bits
Integral Nonlinearity INL Q1.0 LSB
Differential Nonlinearity DNL No missing codes Q1.0 LSB
Offset Error 1.2 Q3.0 LSB
Gain Error (Note 5) 0.02 Q5.5 LSB
Offset Error Temperature Coefficient OE
TC
Q2 ppm/NC
Gain Temperature Coefficient GE
TC
Q0.8 ppm/NC
Channel-to-Channel Offset Matching Q0.5 LSB
Line Rejection PSR (Note 6) 0.3 Q2 LSB/V
DYNAMIC PERFORMANCE (100kHz, Input Sine Wave) (Notes 3 and 7)
Signal-to-Noise Plus Distortion SINAD 70 71.9 dB
Signal-to-Noise Ratio SNR 70 72.3 dB
Total Harmonic Distortion
(Up to the 5th Harmonic)
THD -83 -76 dB
Spurious-Free Dynamic Range SFDR 77 84 dB
Intermodulation Distortion IMD f
1
= 99.2432kHz, f
2
= 69.2139kHz -85 dB
Full-Power Bandwidth
-3dB 30
MHz
-0.1dB 5
Full-Linear Bandwidth SINAD ≥ 70dB 0.5 MHz