Datasheet

AVDD to AVSS .....................................................-0.3V to +3.9V
DVDD to DGND ....................................................-0.3V to +3.9V
DVDD to AVSS .....................................................-0.3V to +3.9V
AVSS to DGND ..................................................-1.95V to +0.3V
Analog Inputs
(AINP, AINM, REFP, REFN, CAPP, CAPN)
to AVSS ........... -0.3V to the lower of 3.9V or (V
AVDD
+ 0.3V)
Digital Inputs to DGND
(RSTB, SYNC, DIN, SCLK, CLK,
GPIO1-3) ......... -0.3V to the lower of 3.9V or (V
DVDD
+ 0.3V)
Digital Outputs to DGND
(RDYB, DOUT,
GPIO1-3) ......... -0.3V to the lower of 3.9V or (V
DVDD
+ 0.3V)
Digital Inputs to AVSS
(RSTB, SYNC, DIN, SCLK, CLK,
GPIO1–GPIO3).................................................-0.3V to +3.9V
Digital Outputs to AVSS
(RDYB, DOUT, GPIO1–3) ....................................-0.3V to +3.9V
CAPREG to DGND ...............................................-0.3V to +2.2V
CAPREG to AVSS ................................................-0.3V to +3.9V
Continuous Power Dissipation (Single-Layer Board)
TSSOP (derate 13.9mW/°C above +70°C) .......... 1111.10mW
Operating Temperature Range ........................... -40°C to +85°C
Storage Temperature Range ............................ -55°C to +150°C
Junction Temperature (continuous) ................................. +150°C
Lead temperature (soldering, 10s) ..................................+300°C
Soldering Temperature (reflow) ....................................... +260°C
TSSOP
Junction-to-Case Thermal Resistance (θ
JC
)................13°C/W Junction-to-Ambient Thermal Resistance (θ
JA
)...........72°C/W
(Note 1)
Electrical Characteristics
(V
AVDD
= 3.6V, V
AVSS
= 0V, V
DVDD
= 2.0V, V
REFP
= 2.5V, V
REFN
= 0V; f
DATA
= 1000sps, External Clock = 8.192MHz; Continuous
conversion mode (SCYCLE = 0); PGA maximum output is 300mV below AVDD and minimum output is 300mV above AVSS,
T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
STATIC PERFORMANCE
Noise-Free Resolution
(Note 3)
NFR
1.9sps data rate (Bypass Mode only) 19.2 20.4
Bits
1ksps data rate (Bypass Mode only) 16.9 17.4
NOISE REFERRED TO INPUT V
N
(See Tables 1–4)
Integral Nonlinearity INL
Bypass, Buffer, PGA = 1, 2 1 4
ppm
PGA > 2 2
Offset Error V
OS
After system offset calibration 10 nV
Offset Drift V
OS_DRIFT
50 nV/°C
Gain Error G
ERR
After system gain calibration 2 ppm
Gain Drift G
ERR_DRIFT
0.05 ppm/°C
DC Common-Mode
Rejection (Note 4)
CMR
DC
Bypass and Buffer mode 120 135
dB
PGA Gain = 4 100 120
AVDD, AVSS DC Supply
Rejection Ratio
PSRRA
Bypass and Buffer mode 80 105
dB
PGA Gain = 4 80 100
DVDD DC Supply Rejection
Ratio
PSRRD
Bypass and Buffer mode 95 120
dB
PGA Gain = 4 95 120
MAX11270 24-Bit, 10mW, 130dB SNR, 64ksps Delta-Sigma
ADC with Integrated PGA
www.maximintegrated.com
Maxim Integrated │ 6
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics