Datasheet

Maxim Integrated │ 2
MAX11166/MAX11167 16-Bit, 500ksps/250ksps, ±5V SAR ADCs
with Internal Reference in TDFN
www.maximintegrated.com
V
DD
to GND ............................................................-0.3V to +6V
OVDD to GND ....... -0.3V to the lower of (V
DD
+ 0.3V) and +6V
AIN+ to GND ........................................................................ Q7V
AIN-, REF, REFIO, AGNDS
to GND ............... -0.3V to the lower of (V
DD
+ 0.3V) and +6V
SCLK, DIN, DOUT, CNVST
to GND ............... -0.3V to the lower of (V
DD
+ 0.3V) and +6V
Maximum Current into Any Pin...........................................50mA
Continuous Power Dissipation (T
A
= +70NC)
TDFN (derate 18.2mW/NC above +70NC) .................. 1349mW
Operating Temperature Range ........................... -40NC to +85NC
Junction Temperature ...................................................... +150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) .................................+300NC
Soldering Temperature (reflow) ....................................... +260NC
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(V
DD
= 4.75V to 5.25V, V
OVDD
= 2.3V to 5.25V, f
SAMPLE
= 500kHz or 250kHz, V
REF
= 4.096V; T
A
= T
MIN
to T
MAX
, unless otherwise
noted. Typical values are at T
A
= +25NC.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
TDFN
Junction-to-Ambient Thermal Resistance (q
JA
).......59.3NC/W
Junction-to-Case Thermal Resistance (q
JC
) ...........22.5NC/W
Package Thermal Characteristics
(Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ANALOG INPUT (Note 3)
Input Voltage Range AIN+ to AIN-, K = -K x V
REF
+K x V
REF
V
Absolute Input Voltage Range
AIN+ to GND
-(V
DD
+
0.1)
+(V
DD
+
0.1)
V
AIN- to GND -0.1 +0.1
Input Leakage Current Acquisition phase -10 +0.001 +10 µA
Input Capacitance 15 pF
Input-Clamp Protection Current Both inputs -20 +20 mA
DC ACCURACY (Note 4)
Resolution N 16 Bits
No Missing Codes 16 Bits
Offset Error -1.5 ±0.1 +1.5 mV
Offset Temperature Coefficient ±2.4 µV/°C
Gain Error ±2 ±10 LSB
Gain Error Temperature
Coefficient
±1 ppm/°C
Integral Nonlinearity INL
MAX11167, T
A
= T
MIN
to T
MAX
-2.0 ±0.5 +2.0
LSB
MAX11167, T
A
= +25°C to +85°C -1.0 ±0.5 +1.0
MAX11166, T
A
= T
MIN
to T
MAX
-2.4 ±0.5 +2.4
MAX11166, T
A
= +25°C to +85°C -1.5 ±0.5 +1.5
Differential Nonlinearity DNL -0.5 ±0.2 +0.5 LSB
Positive Full-Scale Error ±14 LSB
5.000
4.096