Datasheet

13Maxim Integrated
MAX11129–MAX11132
3Msps, Low-Power, Serial 12-/10-Bit,
8-/16-Channel ADCs
Pin Description
MAX11129
MAX11131
(16 CHANNEL)
TQFN
MAX11131
(16 CHANNEL)
TSSOP
MAX11130
MAX11132
(8 CHANNEL)
TQFN
NAME FUNCTION
26, 27, 28, 1–11 1–14 — AIN0–AIN13 Analog Inputs
— — 26, 27, 28, 1–5 AIN0–AIN7 Analog Inputs
12 15 —
CNVST/
AIN14
Active-Low Conversion Start Input/Analog Input 14
— — 12
CNVST
Active-Low Conversion Start Input
13 16 — REF-/AIN15 External Differential Reference Negative Input /Analog Input 15
— — 13 REF- External Differential Reference Negative Input
14, 16 17, 19 6–11, 14, 16 GND Ground
15 18 15 REF+
External Positive Reference Input. Apply a reference voltage at
REF+. Bypass to GND with a 0.47FF capacitor.
17, 18 20, 21 17, 18 V
DD
Power-Supply Input. Bypass to GND with a 10FF in parallel with
a 0.1FF capacitors.
19 22 19 SCLK Serial Clock Input. Clocks data in and out of the serial interface
20 23 20
CS
Active-Low Chip Select Input. When CS is low, the serial
interface is enabled. When CS is high, DOUT is high
impedance or three-state.
21 24 21 DIN
Serial Data Input. DIN data is latched into the serial interface on
the rising edge of SCLK.
22 25 22 DGND Digital I/O Ground
23 26 23 OVDD
Interface Digital Power-Supply Input. Bypass to GND with a
10FF in parallel with a 0.1FF capacitors.
24 27 24 DOUT
Serial Data Output. Data is clocked out on the falling edge of
SCLK. When CS is high, DOUT is high impedance or three-
state.
25 28 25
EOC
End of Conversion Output. Data is valid after EOC pulls low
(internal clock mode only).
— — — EP
Exposed Pad. Connect EP directly to GND plane for
guaranteed performance.