Datasheet

MAX1112/MAX1113
+5V, Low-Power, Multi-Channel,
Serial 8-Bit ADCs
______________________________________________________________________________________ 19
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
DD
SCLK
CS
DIN
CH3
CH2
CH1
CH0
TOP VIEW
SSTRB
DOUT
DGND
AGND
CH7
CH6
CH5
CH4
12
11
9
10
REFOUT
REFIN
SHDN
COM
MAX1112
SSOP
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
V
DD
SCLK
CS
DIN
SSTRB
DOUT
DGND
AGND
CH0
CH1
CH2
CH3
COM
SHDN
REFIN
REFOUT
MAX1113
QSOP
Pin Configurations
___________________Chip Information
Ordering Information
PART
MAX1112C/D
MAX1112EAP+ -40°C to +85°C
0°C to +70°C
TEMP RANGE PIN-PACKAGE
Dice*
20 SSOP
PROCESS:CMOS
SUBSTRATE CONNECTED TO DGND
MAX1112CAP+
0°C to +70°C 20 SSOP
MAX1113CEE+
0°C to +70°C 16 QSOP
MAX1113EEE+ 40°C to +85°C 16 QSOP
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Dice are specified at T
A
= +25°C, DC parameters only.
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages
. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 SSOP A20+1
21-0056 90-0094
16 QSOP E16+1
21-0055 90-0167