Datasheet

MAX11040K/MAX11060
24-/16-Bit, 4-Channel, Simultaneous-Sampling,
Cascadable, Sigma-Delta ADCs
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
AV
DD
= +3.0V to +3.6V, V
DV
DD
= +2.7V to V
AV
DD
, f
XIN CLOCK
= 24.576MHz, f
OUT
= 16ksps, V
REFIO
= +2.5V (external), C
REFIO
=
C
REF0
= C
REF1
= C
REF2
= C
REF3
= 1μF to AGND, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................-0.3V to +4V
DVDD to DGND ......................................-0.3V to (V
AVDD
+ 0.3V)
AGND to DGND.....................................................-0.3V to +0.3V
DIN, SCLK, CS, XIN, SYNC, DRDYIN,
CASCIN to DGND..............................-0.3V to (V
DVDD
+ 0.3V)
DOUT, DRDYOUT, CASCOUT, CLKOUT,
XOUT to DGND..................................-0.3V to (V
DVDD
+ 0.3V)
FAULT, OVRFLW to DGND ...................................-0.3V to +4.0V
AIN_+ to AIN_- ......................................................-6.0V to +6.0V
AIN_ _ to AGND (V
AVDD
3V, V
DVDD
2.7V, FAULTDIS = 0,
SHDN = 0, f
XIN CLOCK
20MHz)......................-6.0V to +6.0V
AIN_ _ to AGND (V
AVDD
< 3V or V
DVDD
< 2.7V or FAULTDIS = 1
or SHDN = 1 or f
XIN CLOCK
< 20MHz)..............-3.5V to +3.5V
REFIO, REF_ to AGND............................-0.3V to (V
AVDD
+ 0.3V)
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (T
A
= +70°C)
TSSOP (derated 13.7mW/°C above +70°C)..............1096mW
Operating Temperature Range .........................-40°C to +105°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC ACCURACY (Note 2)
MAX11040K 24
Resolution
MAX11060 16
Bits
Differential Nonlinearity DNL
24-b i t no mi ssing cod e ( M AX11040K) ;
16-b i t no mi ssing cod e ( M AX 11060)
0.1 LSB
T
A
= +25°C and + 10C (MAX11040K) 0.001 0.004
T
A
= -40°C (MAX11040K) 0.006
Integral Nonlinearity (Note 3) INL
MAX11060 0.001
%FS
Offset Error -1 +1 mV
Gain Error (Note 4) -1 +1 %FS
Offset-Error Drift (Note 5) 0.5 ppm/°C
Gain-Error Drift (Note 5) 1 ppm/°C
Change in Gain Error vs. f
OUT
f
OUT
= 0.25ksps to 64ksps < 0.025 % FS
Channel-to-Channel Gain Matching 0.03 % FS
DYNAMIC SPECIFICATIONS (62.5Hz sine-wave input, 2.17V
P-P
)
(Note 6) (MAX11040K) 103 106
Signal-to-Noise Ratio SNR
(Note 6) (MAX11060) 94.5
dB
T
A
= + 25°C and + 105°C ( M AX 11040K) -94
T
A
= -40°C (MAX11040K) -90Total Harmonic Distortion THD
MAX11060 -106
dB
T
A
= + 25°C and + 105°C ( M AX 11040K) 93 98
T
A
= -40°C (MAX11040K) 89Signal-to-Noise Plus Distortion SINAD
MAX11060 94
dB
T
A
= + 25°C and + 105°C ( M AX 11040K) 94 100
T
A
= -40°C (MAX11040K) 89
Spurious-Free Dynamic Range SFDR
MAX11060 100
dB
0.1%FS input (MAX11040K) 0.25
Relative Accuracy (Note 7)
6.0%FS input (MAX11040K) 0.005
%