Datasheet

4-/6-/8-Channel, 16-/14-Bit,
Simultaneous-Sampling ADCs
13
Maxim Integrated
MAX11044/MAX11044B/MAX11045/MAX11045B/
MAX11046/MAX11046B/MAX11054/MAX11055/MAX11056
Pin Description (continued)
MAX11044/
MAX11044B
(TQFP-EP)
MAX11045/
MAX11045B
(TQFP-EP)
MAX11046/
MAX11046B
(TQFP-EP)
NAME FUNCTION
26, 55 26, 55 26, 55 RDC_SENSE
Reference Buffer Sense Feedback. Connect to RDC
plane.
27, 33, 40, 48,
54
27, 33, 40, 48,
54
27, 33, 40, 48,
54
RDC
Refer ence Buffer D ecoup l i ng . C onnect al l RD C outp uts
tog ether . Byp ass to AG N D w i th at l east an 80μF total
cap aci tance. S ee the Layout, Gr ound i ng , and Byp assi ng
secti on.
37 34 31 CH0 Channel 0 Analog Input
39 37 34 CH1 Channel 1 Analog Input
42 39 37 CH2 Channel 2 Analog Input
44 42 39 CH3 Channel 3 Analog Input
41 41 41 REFIO
External Reference Input/Internal Reference Output.
Place a 0.1μF capacitor from REFIO to AGND.
— 44 42 CH4 Channel 4 Analog Input
— 47 44 CH5 Channel 5 Analog Input
— — 47 CH6 Channel 6 Analog Input
— — 50 CH7 Channel 7 Analog Input
61 61 61 WR
Active-Low Write Input. Drive WR low to write to the
ADC. Configuration registers are loaded on the rising
edge of WR.
62 62 62 CS
Active-Low Chip-Select Input. Drive CS low when
reading from or writing to the ADC.
63 63 63 RD
Active-Low Read Input. Drive RD low to read from the
ADC. Each rising edge of RD advances the channel
output on the data bus.
64 64 64 DB15 16-Bit Parallel Data Bus Digital Output Bit 15
31, 34, 47, 50 31, 50 — I.C. Internally Connected. Connect to AGND.
———EP
E xp osed P ad . Inter nal l y connected to AG N D . C onnect to
a l ar g e g r ound p l ane to m axi m i ze ther m al p er for m ance.
N ot i ntend ed as an el ectr i cal connecti on p oi nt.