Datasheet

DS5002FP Secure Microprocessor Chip
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REVISION HISTORY
REVISION DESCRIPTION
112795
Original release.
073096
Change V
CC02
specification from V
LI
- 0.5 to V
LI
- 0.65 (PCN F62501).
Update mechanical specifications.
111996 Change V
CC01
from V
CC
- 0.3 to V
CC
- 0.35.
061297
PF signal moved from V
OL2
test specification to V
OL1
. PCN No. (D72502).
AC characteristics for battery-backed SDI pulse specification added.
051499
Reduced absolute maximum voltage to V
CC
+ 0.5V.
Added note clarifying storage temperature specification is for nonbattery-backed state.
Deleted I
BAT
specification (Duplicate of I
LI
specification).
Changed RRE min (industrial temp range) from 40kΩ to 30kΩ.
Changed V
PFW
max (industrial temp range) from 4.5V to 4.6V.
Added industrial specification for I
LI
.
Reduced t
CE1HOV
and t
CEHDV
from 10ns to 0ns.
052599 Minor revisions and approval.
062102 Update V
CCO
and I
CCO1
specifications to reflect 0.45V internal voltage drop instead of 0.35V.
100102 Ordering information updated.
030403
Reset Trip Point in Stop Mode (DC Characteristics) with BAT = 3.0V was changed to 3.3V (original issue
was 3.3V).
070605
Added Pb-free part numbers to Ordering Information and Selector Guide.
Added Operating Voltage specification. (This is not a new specification because operating voltage is implied
in the testing limits, but rather a clarification.)
Updated Absolute Maximum soldering temperature to reference JEDEC standard.
090805
In the AC Characteristics—SDI Pin table, changed t
SPR
MAX (in active mode) from 2µs to 1.3µs. This
change is only to correct a documentation error, and does not reflect a change in device operation or any
change in testing.
072806
Removed products from Ordering Information table that do not contain internal micro probe shields.