Datasheet
PIN NAME FUNCTION
10 GND Ground
11 VON Negative Sample/Hold Voltage Output. Do not connect for single-ended mode.
12 VOP Sample/Hold Voltage Output. Positive output in differential mode. Also used for single-ended output.
13 GAIN
Hold Amplier Gain Indicator. Both as output and logic input. Indicates which current mirror’s output is
active. 3.5kΩ input/output impedance.
Pin as input (mirror selection for sample/hold):
Low: Sample/hold Conversion from Current Mirror 1 (VIP1);
High: Sample/hold Conversion from Current Mirror 2 (VIP2).
Pin as output (mirror indication for sample/hold):
Low: Sample/hold Conversion from Current Mirror 1 (VIP1);
High: Sample/hold Conversion from Current Mirror 2 (VIP2).
14
ISRC/
SHDN
Dual-Purpose Pin.
ISRC: A resistor connected to this pin controls the amount of current owing through a current source
connected to MIROUT. (Note: During this mode of operation, the microcontroller pin (if connected)
should be in the high impedance.)
SHDN: If pulled high, sets MIROUT to high-impedance.
15 ILIMS Current-Limit Status. Active-low signal indicating that the current-limit threshold is exceeded.
16 APDV APD Voltage Monitor. Provides output voltage used to calculate the voltage on the APD.
17 RLIM Resistor Limit. Connect a resistor between RLIM and GND to set the current clamp limit.
18
DIS-
CHARGE
Discharge Enable.
When sampling is deactivated and the DISCHARGE pin logic input is low, the discharge function is
disabled.
When sampling is deactivated and the DISCHARGE pin logic input is high, the discharge function is
enabled, and the DS3923 pulls current mirror outputs VIP1 and VIP2 low to ensure accurate sam-
pling.
During the sample time, the pin discaharge is internally disabled by the DS3923. See Figure 4 and
Figure 5 for more detail.
Note: The discharge function should not be used if SENXOR is a logic-high.
19 MIROUT Current Mirror Output. Connect to APD.
20 HVG High-Voltage NMOS FET Gate. Connect to ground if unused.
21 MIRCAP Mirror Filter. Connect external capacitor to lter voltage at MIROUT.
22 MIRIN Current Mirror Input. Connect to high voltage supply.
23 HVGND High-Voltage NMOS FET Source. Connect to ground of the DC-DC boost circuit.
24 HVD High-Voltage NMOS FET Drain. Connect to HVGND if unused.
— EP
Exposed Pad. Connect to ground with a minimum of 9 vias for thermal conductivity improvement. It is
acceptable to use solder mask between the IC and the ground pad. It is not necessary to electrically
connect the exposed pad ground.
DS3923 High-Speed Current Mirror
with Sample/Hold Output
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Pin Description (continued)