Datasheet

____________________________________________________ DS34T101, DS34T102, DS34T104, DS34T108
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17 Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
DS34T101, DS34T102 and DS34T108 have a 484-lead thermally enhanced ball grid array (TEBGA) package. The
TEBGA package dimensions are shown in Maxim document 56-G6038-001.
DS34T
108 has a 484-lead ball grid array with embedded heat sink (HSBGA) package. The HSBGA package
dimensions are shown in Maxim document 56-G6038-002.
18 Thermal Information
Parameter
TEBGA-484
DS34T101
DS34T102
DS34T104
HSBGA-484
DS34T108
Target Ambient Temperature Range
-40 to 85
C -40 to 85C
Die Junction Temperature Range
-40 to 125
C -40 to 125C
Theta Jc (junction to top of case)
4.2
C/W 2.5 C/W
Theta Jb (junction to bottom pins)
7.1
C/W 5.5 C/W
Theta Ja, Still Air (Note 1)
16.1
C/W 13.0 C/W
1m/s
13.3
C/W 10.7 C/W
Theta Ja, Moving Air (Note 1)
2m/s
12.5
C/W 9.6 C/W
Note 1: These numbers are estimates using JEDEC standard PCB and enclosure dimensions.