Datasheet

____________________________________________________ DS34S101, DS34S102, DS34S104, DS34S108
Rev: 032609 197 of 198
17. Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
DS34S101, DS34S102 and DS34S108 have a 256-lead thermally enhanced chip-scale ball grid array (TECSBGA)
package. The TECSBGA package dimensions are shown in Maxim document 21-0353.
DS34S108 has a 484-lead thermally enhanced ball grid array (TEBGA) package. The TEBGA package dimensions
are shown in Maxim document 21-0365.
18. Thermal Information
Parameter
TECSBGA-256
DS34S101
DS34S102
DS34S104
TEBGA-484
DS34S108
Target Ambient Temperature Range
-40 to 85°C
-40 to 85°C
Die Junction Temperature Range
-40 to 125°C
-40 to 125°C
Theta Jc (junction to top of case)
3.7 °C/W
4.5 °C/W
Theta Jb (junction to bottom pins)
13.1 °C/W
7.1 °C/W
Theta Ja, Still Air (Note 1)
26.2 °C/W
15.0 °C/W
Note 1: These numbers are estimates using JEDEC standard PCB and enclosure dimensions.