Datasheet
Extremely Accurate I
2
C-Integrated
RTC/TCXO/Crystal
18 Maxim Integrated
DS3231
Chip Information
SUBSTRATE CONNECTED TO GROUND
PROCESS: CMOS
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages
. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
32kHz
SCL
SDA
V
BAT
GND
N.C.
N.C.
N.C.
N.C.
TOP VIEW
SO
V
CC
INT/SQW
N.C.
RST
N.C.
N.C.
N.C.
DS3231
Pin Configuration
Handling, PC Board Layout,
and Assembly
The DS3231 package contains a quartz tuning-fork
crystal. Pick-and-place equipment can be used, but
precautions should be taken to ensure that excessive
shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
Avoid running signal traces under the package, unless
a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connect-
ed to ground.
Moisture-sensitive packages are shipped from the fac-
tory dry packed. Handling instructions listed on the
package label must be followed to prevent damage
during reflow. Refer to the IPC/JEDEC J-STD-020 stan-
dard for moisture-sensitive device (MSD) classifications
and reflow profiles. Exposure to reflow is limited to 2
times maximum.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 SO W16#H2
21-0042 90-0107