Datasheet

DS28E15
DeepCover Secure Authenticator with
1-Wire SHA-256 and 512-Bit User EEPROM
ABRIDGED DATA SHEET
4Maxim Integrated
ELECTRICAL CHARACTERISTICS (continued)
(T
A
= -40NC to +85NC, unless otherwise noted.) (Note 1)
Note 23: Data retention is tested in compliance with JESD47G.
Note 24: Guaranteed by 100% production test at elevated temperature for a shorter time; equivalence of this production test to the-
data sheet limit at operating temperature range is established by reliability testing.
Note 25: EEPROM writes can become nonfunctional after the data-retention time is exceeded. Long-term storage at elevated tem-
peratures is not recommended.
Note 26: Refer to the full data sheet.
Pin Configurations
Pin Descriptions
PIN
NAME FUNCTION
SFN TDFN-EP TSOC
— 1, 4, 5, 6 3– 6 N.C. Not Connected
1 2 2 IO 1-Wire Bus Interface. Open-drain signal that requires an external pullup resistor.
2 3 1 GND Ground Reference
— — — EP
Exposed Pad (TDFN Only). Solder evenly to the board’s ground plane for proper
operation. Refer to Application Note 3273: Exposed Pads: A Brief Introduction for
additional information.
TOP VIEW
N.C.
IO
GND
N.C.
N.C.
N.C.
TSOC
+
5
4
6
2
3
1
DS28E15
BOTTOM VIEW
NOTE: THE SFN PACKAGE IS QUALIFIED FOR ELECTRO-
MECHANICAL CONTACT APPLICATIONS ONLY, NOT FOR
SOLDERING. FOR MORE INFORMATION, REFER TO
APPLICATION NOTE 4132: ATTACHMENT METHODS FOR
THE ELECTRO-MECHANICAL SFN PACKAGE.
16N.C. N.C.
25IO N.C.
34GND N.C.
TDFN-EP
(3mm × 3mm)
TOP VIEW
DS28E15
28E15
ymrrF
+
*EP
*EXPOSED PAD
1
2
IO
GND
DS28E15
SFN
(3.5mm
× 6.5mm × 0.75mm)