Datasheet

DS26518 8-Port T1/E1/J1 Transceiver
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16. PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
The DS26518 uses a 256-lead thermally enhanced chip scale ball grid array (TE-CSBGA) package. The package dimensions
are shown in Maxim document
56-G6028-001.