Datasheet

DS26303: 3.3V, T1/E1/J1, Short-Haul, Octal Line Interface Unit
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9 THERMAL CHARACTERISTICS
Table 9-1. Thermal Characteristics
PARAMETER MIN TYP MAX UNITS
Power Dissipation with RIMPMS = 0 (Notes 1, 2) 0.7 1.40 W
Power Dissipation with RIMPMS = 1(Notes 1, 2) 0.9 1.65 W
Ambient Temperature (Note 3) -40 +85 °C
Junction Temperature +125 °C
+21.3
(Note 4)
Theta-JA (θ
JA
) in Still Air for 144-Pin LQFP with Exposed Pad
29.0
(Note 5)
°C/W
Note 1: RCLK1-n = TCLK1-n = 1.544MHz.
Note 2:
Power dissipation with all ports active, TTIP and TRIN driving a 25Ω load, for an all-ones data density.
Note 3: The package is mounted on a four-layer JEDEC standard test board.
Note 4:
Theta-JA (θ
JA
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test
board and the die attach pad is soldered to the test board.
Note 5:
Theta-JA (θ
JA
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test
board and the die attach pad is not soldered to the test board.