Datasheet

DS21348/DS21Q348
63 of 76
10. THERMAL CHARACTERISTICS
Table 10-1. Thermal Characteristics—DS21Q348 CSBGA Package
PARAMETER MIN TYP MAX NOTES
Ambient Temperature -40ºC +85ºC 1
Junction Temperature +125ºC
Theta-JA (θ
JA
) in Still Air +24ºC/W 2
Theta-JC (θ
JC
) in Still Air +4.1ºC/W 3
NOTES:
1) The package is mounted on a four-layer JEDEC-standard test board.
2) Theta-JA (θ
JA
) is the junction to ambient thermal resistance, when the package is mounted on a four-
layer JEDEC-standard test board.
3) While Theta-JC (θ
JC
) is commonly used as the thermal parameter that provides a correlation between the
junction temperature (T
j
) and the average temperature on top center of four of the chip-scale BGA
packages (T
C
), the proper term is Psi-JT. It is defined by:
(T
J
- T
C
) / overall package power
The method of measurement of the thermal parameters is defined in EIA/JEDEC-standard document
EIA-JESD51-2.
Table 10-2. Theta-JA (θ
JA
) vs. Airflow
FORCED AIR (m/s) THETA-JA (θ
JA
)
0 24ºC/W
1 21ºC/W
2.5 19ºC/W