Datasheet

DS17285/DS17287/DS17485/DS17487/DS17885/DS17887
Real-Time Clocks
30 ____________________________________________________________________
Chip Information
SUBSTRATE CONNECTED TO GROUND
PROCESS: CMOS
Thermal Information
PACKAGE THETA-JA (°C/W) THETA-JC (°C/W)
DIP 75 30
SO 105 22
Typical Operating Circuit
IRQ
X1 X2
V
CC
V
CC
ALE
DS83C520
DS17285
DS17485
DS17885
WR
RD
CS
AD0–AD7
GND
PWR
V
SB
V
CC
SUPPLY
CONTROL
CIRCUIT
SQW
CRYSTAL
V
CC
KS
RCLR
V
BAUX
V
BAT
PACKAGE TYPE DOCUMENT NO.
24 PDIP (600 mils)
21-0044
24 SO (300 mils)
21-0042
24 EDIP
21-0241
28 TSOP
21-0273
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages
. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.