Datasheet
Voltage Range on Any Pin Relative to Ground ....-0.5V to +6.0V
Continuous Power Dissipation (T
A
= +70°C)
PDIP (derate 9.10mW/°C above +70°C) ................727.30mW
Operating Temperature Range ......................... -55°C to +125°C
Storage Temperature Range ............................ -55°C to +125°C
Soldering Temperature (reflow) ....................................... +260°C
Lead Temperature (soldering, 10s) .................................+300°C
PDIP
Junction-to-Ambient Thermal Resistance (θ
JA
) ........110°C/W Junction-to-Case Thermal Resistance (θ
JC
) ...............40°C/W
(Note 1)
(V
DD
= 2.7V to 5.5V, T
A
= -55°C to +125°C, unless otherwise noted.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
DD
(Note 2) 2.7 5.0 5.5 V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Thermometer Error T
ERR
0°C to +70°C ±0.5
°C
-55°C to +125°C ±2.0
Thermometer Resolution 12-bit 0.0625 °C
Low-Level Input Voltage V
IL
-0.3 0.3 x V
DD
V
High-Level Input Voltage V
IH
0.7 x V
DD
V
DD
+ 0.3 V
Pulse Width of Spikes That Must
Be Suppressed by the Input Filter
t
SP
Fast mode 0 50 ns
Low-Level Output Voltage (SDA)
V
OL1
3mA sink current (Note 2) 0 0.4
V
V
OL2
6mA sink current (Note 2) 0 0.6
Input Current Each I/O Pin 0.4 < V
I/O
< 0.9V
DD
(Note 4) -1 +1 µA
I/O Capacitance C
I/O
10 pF
Active Supply Current I
CC
Temperature conversion 1250
µAE
2
write (Notes 5, 6) 400
Communication only 125
Standby Supply Current I
STBY
(Notes 5, 6, 7) 1 3 µA
DS1624 Digital Thermometer and Memory
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2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of time may affect device reliability.
Package Thermal Characteristics
DC Electrical Characteristics
Recommended Operating Conditions