Datasheet

PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO.
10 µSOP —
21-0061 90-0330
DS1390/
DS1394
DS1393
DS1391
DS1392
CE
SQW
I/O
CPU
V
CC
V
CC
V
CC
DIN
CS
GND
X2X1
CRYSTAL
SQW/INT
V
BACKUP
SCLK
DOUT
INT
CPU
V
CC
V
CC
V
CC
CE
GND
X2X1
CRYSTAL
SQW/INT
V
BACKUP
SCLK
I/O
CPU
V
CC
V
CC
V
CC
DIN
RST
RST
CS
GND
X2X1
CRYSTAL
V
BACKUP
SCLK
DOUT
CPU
V
CC
V
CC
V
CC
GND
X2X1
CRYSTAL
V
BACKUP
SCLK
RST
RST
www.maximintegrated.com
Maxim Integrated │ 25
DS1390–DS1394 Low-Voltage SPI/3-Wire RTCs
with Trickle Charger
Typical Operating Circuits
Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.