Datasheet

I
2
C RTC/Supervisor with Trickle Charger
and 512 Bytes EEPROM
2 Maxim Integrated
DS1388
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
(T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on V
CC
or V
BACKUP
Pins
Relative to Ground.............................................-0.3V to +6.0V
Voltage Range on Inputs Relative
to Ground ...............................................-0.3V to (V
CC
+ 0.3V)
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 1)..170°C/W
Junction-to-Case Thermal Resistance (θ
JC
) (Note 1) ......40°C/W
Operating Temperature Range
(noncondensing) .............................................-40°C to +85°C
Storage Temperature Range .............................-55°C to +125°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DS1388Z-5 4.5 5 5.5
DS1388Z-33 2.97 3.3 3.63
Supply Voltage V
CC
(Note 3)
DS1388Z-3 2.7 3 3.3
V
Logic 1 V
IH
(Note 3)
0.7 x
V
CC
V
CC
+
0.3
V
Logic 0 V
IL
(Note 3) -0.3
+0.3 x
V
CC
V
Pullup Voltage (SCL, SDA),
V
CC
= 0V
V
PU
5.5 V
V
BACKUP
Voltage V
BACKUP
(Note 3) 1.3 3.0 5.5 V
DS1388Z-5 4.15 4.33 4.50
DS1388Z-33 2.70 2.88 2.97
Power-Fail Voltage V
PF
(Note 3)
DS1388Z-3 2.45 2.60 2.70
V
DC ELECTRICAL CHARACTERISTICS
(V
CC
= V
CC(MIN)
to V
CC(MAX)
, T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
R1 (Notes 4, 5) 250
R2 (Note 6) 2000
Trickle-Charger Current-Limiting
Resistors
R3 (Note 7) 4000

Input Leakage (SCL) I
LI
-1 +1 μA
I/O Leakage (SDA) I
LO
-1 +1 μA
I/O Leakage (RST) I
LORST
(Note 8) -200 +10 μA
SDA Logic 0 Output
(V
OL
= 0.15 x V
CC
)
I
OLDOUT
3 mA
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.