Datasheet

19Maxim Integrated
Low-Current SPI/3-Wire RTCs
DS1343/DS1344
Ordering Information
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Chip Information
SUBSTRATE CONNECTED TO GROUND
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PART TEMP RANGE
TYP OPERATING
VOLTAGE (V)
OSC C
L
(pF)
PIN-PACKAGE
DS1343E-18+
-40NC to +85NC
1.8 6 20 TSSOP
DS1343E-3+
-40NC to +85NC
3.0 6 20 TSSOP
DS1343E-33+
-40NC to +85NC
3.3 6 20 TSSOP
DS1343D-18+
-40NC to +85NC
1.8 6 14 TDFN-EP*
DS1343D-3+
-40NC to +85NC
3.0 6 14 TDFN-EP*
DS1343D-33+
-40NC to +85NC
3.3 6 14 TDFN-EP*
DS1344E-18+
-40NC to +85NC
1.8 12.5 20 TSSOP
DS1344E-3+
-40NC to +85NC
3.0 12.5 20 TSSOP
DS1344E-33+
-40NC to +85NC
3.3 12.5 20 TSSOP
DS1344D-18+
-40NC to +85NC
1.8 12.5 14 TDFN-EP*
DS1344D-3+
-40NC to +85NC
3.0 12.5 14 TDFN-EP*
DS1344D-33+
-40NC to +85NC
3.3 12.5 14 TDFN-EP*
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 TSSOP U20+1
21-0066 90-0116
14 TDFN-EP T1433+2
21-0137 90-0063