Datasheet

DS1339 I
2
C Serial Real-Time Clock
19 of 20
HANDLING, PCB LAYOUT, AND ASSEMBLY
The DS1339C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020B standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
CHIP INFORMATION
PROCESS: CMOS
PACKAGE INFORMATION
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO.
8 µSOP U8+1 21-0036 90-0092
16 SO W16#H2 21-0042 90-0107
µ
SOP
SQW/INT
X1
X2
GND
V
CC
SCL
SDA
V
BACKUP
DS1339
TOP VIEW
SQW/
INT
SCL SDA
GND
V
BACKUP
V
CC
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
DS1339C
SO (300 mils)
TOP VIEW