Datasheet
DS1337 I
2
C Serial Real-Time Clock
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
The DS1337C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
TOP VIEW
SCL
SDA
DS1337C
SQW/
I
NT
B
GND
CHIP INFORMATION
TRANSISTOR COUNT: 10,950
PROCESS: CMOS
THERMAL INFORMATION
PACKAGE
THETA-J
A
(°C/W)
THETA-J
C
(°C/W)
8 DIP 110 40
8 SO 170 40
8 μSOP 229 39
16 SO 73 23
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
8 PDIP P8+8 21-0043
8 SO S8+2 21-0041
8 MAX U8+1 21-0036
16 SO W16-H2 21-0042
DIP
I
NTA
V
CC
I
NTA
V
CC
X1
V
CC
X1
N.C.
DS1337
N.C.
SQ
W/
I
NTB
X2
SQW/
I
NTB
X2
DS1337
N.C.N.C.
SCL
I
NTA
SCL
N.C.
N.C.
SDA
GND
SDA
GND
N.C.N.C.
SO
,
SOP
N.C.
N.C.
SO (300 mils)