Datasheet

DS1337 I
2
C Serial Real-Time Clock
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
The DS1337C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
CHIP INFORMATION
TRANSISTOR COUNT: 10,950
PROCESS: CMOS
THERMAL INFORMATION
PACKAGE
THETA-J
A
(°C/W)
THETA-J
C
(°C/W)
8 DIP
110
40
8 SO
170
40
8 μSOP
229
39
16 SO
73
23
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
8 PDIP P8+8
21-0043
8 SO S8+2
21-0041
8 µMAX U8+1
21-0036
16 SO W16-H2
21-0042
TOP VIEW
DIP
INTA
X1
X2
GND
V
CC
SCL
SDA
SQW/INTB
DS1337
SO, µSOP
X1
X2
GND
V
CC
SCL
SDA
SQW/INTB
INTA
DS1337
SQW/INTB
SCL
SDA
GND
INTA
V
CC
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
DS1337C
SO (300 mils)
15 of 16