Datasheet

DS1318
Parallel-Interface Elapsed Time Counter
14 ____________________________________________________________________
Chip Information
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages
. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
24 TSSOP U24+2
21-0066 90-0118