Datasheet
DS_8010C_024 73S8010C Data Sheet 
Rev. 1.5    27 
Revision History 
Revision Date  Description 
1.0 6/13/2005 First publication. 
1.2  9/21/2005  Changed SDATA hold time. 
1.3 12/5/2007 
Added ISO and ENV logo, remove leaded package options, replace 32QFN punched 
with SAWN, update 28SO dimension. 
1.4  1/17/2008  Changed dimension of bottom exposed pad on 32QFN mechanical package 
figure. 
1.5  4/3/2009  Removed all references to VPC as VPC must be tied to VDD. 
© 2009 Teridian Semiconductor Corporation. All rights reserved. 
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation. 
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation. 
All other trademarks are the property of their respective owners. 
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly 
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms 
and Conditions. The company assumes no responsibility for any errors which may appear in this 
document, reserves the right to change devices or specifications detailed herein at any time without 
notice and does not make any commitment to update the information contained herein. Accordingly, the 
reader is cautioned to verify that this document is current by comparing it to the latest version on 
http://www.teridian.com or by checking with your sales representative. 
Teridian Semiconductor Corp., 6440 Oak Canyon Rd., Suite 100, Irvine, CA 92618 
TEL (714) 508-8800, FAX (714) 508-8877, http://www.Teridian.com 










