Datasheet

71M6521DE/DH/FE Data Sheet
Page: 90 of 107 Rev 3
RECOMMENDED EXTERNAL COMPONENTS
NAME
FROM
TO
FUNCTION
VALUE
UNIT
C1
V3P3A
AGND
Bypass capacitor for 3.3 V supply
≥0.1±20%
µF
C2
V3P3D
DGND
Bypass capacitor for 3.3 V output
0.1±20%
µF
CSYS
V3P3SYS
DGND
Bypass capacitor for V3P3SYS
≥1.0±30%
µF
C2P5
V2P5
DGND
Bypass capacitor for V2P5
0.1±20%
µF
XTAL
XIN XOUT
32.768 kHz crystal – electrically similar to ECS
.327-12.5-17X or Vishay XT26T, load capaci-
tance 12.5 pF
32.768 kHz
CXS
†
XIN
AGND
Load capacitor for crystal (exact value depends
on crystal specifications and parasitic capaci-
tance of board).
27±10%
pF
CXL
†
XOUT AGND
27±10%
pF
†
Depending on trace capacitance, higher or lower values for CXS and CXL must be used. Capacitance from XIN to
GNDD and XOUT to GNDD (combining pin, trace and crystal capacitance) should be 35pF to 37pF.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
CONDITION
MIN
TYP
MAX
UNIT
3.3V Supply Voltage (V3P3SYS, V3P3A)
V3P3A and V3P3SYS must be at the
same voltage
Normal Operation
3.0
3.3
3.6
V
Battery Backup
0
3.6
V
VBAT
No Battery
Externally Connect to V3P3SYS
Battery Backup
BRN and LCD modes
SLEEP mode
3.0
2.0
3.8
3.8
V
V
Operating Temperature
-40
+85
ºC
Maximum input voltage on DIO/SEG pins
configured as DIO input. *
MISSION mode
BROWNOUT mode
LCD mode
V3P3SYS+0.3
VBAT+0.3
VBAT+0.3
V
V
V
*Exceeding this limit will distort the LCD waveforms on other pins.