Datasheet
[AK4646]
MS0557-E-06 2011/06
- 78 -
PACKAGE (AK4646EZ)
32pin QFN (Unit: mm)
2.4 ± 0.1
0.4
0.18 ± 0.05
0.00 MIN
0.05 MAX
0.65 MAX
2.4 ± 0.1
1
9
16
25
4.0 ± 0.1
4.0 ± 0.1
0.45 ± 0.10
A
B
0.05
M
0.08
8
32
17
24
PIN #1 ID
Exposed
Pad
0.40 ± 0.10
0.22 ± 0.05
C0.3
Note) The exposed pad on the bottom surface of the package must be open or connected to the ground.
Note that the maximum operating ambient temperature is 70
°C when it is open.
■ Material & Lead finish
Package molding compound: Epoxy
Lead frame material: Cu
Lead frame surface treatment: Solder (Pb free) plate