Datasheet

[AK4646]
MS0557-E-06 2011/06
- 77 -
PACKAGE (AK4646EN)
32pin QFN (Unit: mm)
4.75 ± 0.10
5.00 ± 0.10
4.75 ± 0.10
0.50
0.23
24 17
25
1
16
1
0.01
0.08
32
8
9
C0.42
32
+0.07
-0.05
0.40 ± 0.10
0.20
+ 0.04
- 0.01
C
Exposed
Pad
3.5
5.00 ± 0.10
0.85 ± 0.05
C
B
A
0.10
M
AB
3.5
Note) The exposed pad on the bottom surface of the package must be open or connected to the ground.
■ Material & Lead finish
Package molding compound: Epoxy
Lead frame material: Cu
Lead frame surface treatment: Solder (Pb free) plate