Data Sheet

Smart Machine Smart Decision
SIM800F_Hardware Design_V1.00 58 2015-07-31
7.1. The Moisture Sensitivity Level
The moisture sensitivity level of SIM800 is 3. The module should be mounted within 168 hours after unpacking
in the environmental conditions of temperature <30°C and relative humidity of <60% (RH). It is necessary to
bake the module if the above conditions are not met.
Table 51: Moisture classification level and floor life
Level
Floor Life (out of bag) at factory ambient≤30°C /60% RH or as stated
1
Unlimited at ≤30°C /85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the
label.
Note:
1. If the vacuum package is not open for 6 months or longer than the packing date, baking is also recommended before
re-flow soldering.
2. For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.2. Baking Requirements
Because of its sensitivity to moisture absorption, SIM800 should be baked sufficiently before re-flow soldering.
Otherwise SIM800 will be at the risk of permanent damage during re-flow soldering. SIM800 should be baked
192 hours at temperature 40°C +5°C /-0°C and <5% RH for low-temperature device containers, or 72 hours at
temperature 80°C±5°C for high-temperature device containers. Note that the plastic tray is not heat resistant, so
SIM800 modules should be taken out for baking, otherwise the tray may be damaged by high-temperature during
baking.
Table 52: Baking requirements
Baking temperature Moisture Time
40°C±5°C <5% 192 hours
120°C±5°C <5% 4 hours