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SCOPE

：

This specification applies to the Pb Free high current type SMD inductors for

MSCDB-1807H-SERIES

PRODUCT INDENTIFICATION

MSCDB-1807 H-680 M

① ② ③ ④ ⑤

① Product Code

② Dimensions Code

③ High Current

④ Inductance Code

⑤

Tolerance Code

(1) SHAPES AND DIMENSIONS

A: 19.40 Max. mm

B: 13.30 Max. mm

C: 6.80 Max. mm

D: 12.2 Typ. mm

(2) ELECTRICAL SPECIFICATIONS

SEE TABLE 1

TEST INSTRUMENTS

L : HP 4284A PRECISION LCR METER (or equivalent)

RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)

(3) CHARACTERISTICS

(3)-1 Ambient temperature ……......... ＋60℃ Max.

(3)-2 Operate temperature range ...... －40℃～＋125℃

(Including self temp. rise)

(3)-3 Storage temperature range ...... －40℃～＋125℃

MSCDB-1807H-SERIES Page 1/8

MAG.LAYERS

Summary of content (8 pages)

PAGE 1
SCOPE： This specification applies to the Pb Free high current type SMD inductors for MSCDB-1807H-SERIES PRODUCT INDENTIFICATION MSCDB-1807 H-680 M ① ② ③ ④⑤ ① Product Code ② Dimensions Code ③ High Current ④ Inductance Code ⑤ Tolerance Code (1) SHAPES AND DIMENSIONS A: 19.40 Max. mm B: 13.30 Max. mm C: 6.80 Max. mm D: 12.2 Typ.
PAGE 2
TABLE 1 MAGLAYERS Inductance Percent PT/NO. L(μH) Tolerance MSCDB-1807H-4R7□ 4.7 N 100kHz,0.25V MSCDB-1807H-6R8□ 6.8 N MSCDB-1807H-680□ 68 M,N Test Resistance Frequency RDC(Ω)Max. Rated DC Current Marking IDC1(A) IDC2(A) 12m 6.5 7.0 4R7 100kHz,0.25V 19m 5.8 5.5 6R8 100kHz,0.25V 0.156 1.6 2.0 680 ※ □ specify the inductance tolerance,M(±20%),N(±30%) ※ IDC1： Based on inductance change (△L/Lo： drop 10%Max. ) IDC2： Based on temperature rise (△T： 40℃ TYP.
PAGE 3
(4) RELIABILITY TEST METHOD MECHANICAL TEST ITEM Substrate bending SPECIFICATION △L/Lo≦±5% TEST DETAILS The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
PAGE 4
MECHANICAL TEST ITEM SPECIFICATION There shall be Soldering heat no damage or (reflow soldering) problems. Temperature profile of reflow soldering Sodering temperature (℃) Resistance to soldering (Peak temperature 260±3℃ 10 sec 300 250 200 150 100 30 sec Min Pre-heating (230+0 ℃) Slow cooling (Stored at room temperature) 150 ~ 180℃ 50 2 min 10 sec. 2 min. or more The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time.
PAGE 5
ENVIROMENT CHARACTERISTICS TEST ITEM High temperature SPECIFICATION △L/Lo≦±5% storage The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2℃ and a normal humidity. Low temperature There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour. △L/Lo≦±5% The sample shall be left for 96±4 hours in an atmosphere with storage a temperature of -25±3℃.
PAGE 6
(5) LAND DIMENSION (Ref.) PCB: GLASS EPOXY t＝1.6mm (5)-1 LAND PATTERN DIMENSIONS (STANDARD PATTERN) (5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD MAG.
PAGE 7
(6) PACKAGING 5.5 (6)-1 CARRIER TAPE DIMENSIONS (mm) (6)-2 TAPING DIMENSIONS (mm) Unreeling Direction MAG.
PAGE 8
(6)-3 REEL DIMENSIONS (mm) Tape width:32 (6)-4 QUANTITY 250pcs/Reel The products are packaged so that no damage will be sustained. MAG.