User guide

MAG.LAYERS
MMD-06AB-SERIES-S1
NOTE
：Dimensions in mm
PRODUCT NO. A B C D E
MMD-06AB-SERIES-S1
6.86 ± 0.38 6.47 ± 0.25 1.2Max 3.0 ± 0.3 1.3 ± 0.3
■ E
E
E
L
L
L
E
E
E
C
C
C
T
T
T
R
R
R
I
I
I
C
C
C
A
A
A
L
L
L
R
R
R
E
E
E
Q
Q
Q
U
U
U
I
I
I
R
R
R
E
E
E
M
M
M
E
E
E
N
N
N
T
T
T
S
S
S
R
dc
(mΩ)
PART NUMBER
INDUCTANCE
Lo(μH)±20%
@0A
Typ. Max
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS
2
MMD-06AB-R47M-S1 0.47 15 17 8 11
MMD-06AB-R68M-S1 0.68 17 19 7 8
MMD-06AB-1R0M-S1 1.0 26 28 6 7
MMD-06AB-1R5M-S1 1.5 35.5 40.8 4 6
MMD-06AB-2R2M-S1 2.2 75 82.5 3.5 4.4
MMD-06AB-3R3M-S1 3.3 90 103 3 3.6
MMD-06AB-4R7M-S1 4.7 155 170 2.4 2.8
MMD-06AB-6R8M-S1 6.8 189 217 2.1 2.4
MMD-06AB-100M-S1 10 250 290 1.8 2.2
TEST FREQUENCY:100KHz,0.25V
TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
dc
:CH11025,GOM802 MICRO OHMMETER
NOTES:
1.DC current (I dc ) that will cause an approximate △T of 40℃
2.DC current (I sat ) that will cause Lo to drop approximately 30%
3.All test data is referenced to 25℃ ambient
4.Operating Temperature Range -55℃ to +125℃
5.The part temperature (ambient + temp rise) should not exceed 125℃under worst case
operating conditions. Circuit design, component placement, PWB trace size and
thickness, airflow and other cooling provisions all affect the part temperature. Part
temperature should be verified in the end application.