Owner manual

MAG.LAYERS
GMLB-100505-B Series
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• Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the term
inal electrode shall
be covered with fresh solder.
Solder: 96.5Sn-3.0Ag-0.5Cu
Solder Temperature: 245 ± 5℃
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More tha
n 75% of the terminal electrode shall
be covered with solder.
Solder: 96.5Sn-3.0Ag-0.5Cu
Solder temperature : 260 ± 5℃
Flux: Rosin
Dip time: 10 ± 1 seconds
TYPE W(KGF) TIME (SEC)
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
GMLB-100505 0.2 30 ± 5
TYPE A(MM) P(KGF)
Bending Strength
No mechanical damage.
The ferrite shall not be damaged.
A
Chip
P
1.0
R0.5
GMLB-100505 0.4 0.2
Bending Test
Appearance: No damage
Substrate: PCB(100mm×40mm×1.6mm)
Solder: Reflow
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
Vibration
Impedance shall be within ± 20% of the initial
value.
There shall be no mechanical damage.
The sample shall be soldered onto the printed
circuit board
and when a vibration having an
amplitude of 1.52mm
and a frequency of from
10 to 55Hz/1 minute repeated should
be
applied to the 3 d
irections (X,Y,Z) for 2 hours
each.
Drop shock
No apparent damage
Dropped onto printed circuit board from
100cm height three times in x, y, z directions.
The terminals shall be protected.
• Climatic test
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Temperature: -55℃~125℃ for 30 minutes
each, 100 cycles.
Humidity Resistance
Temperature : 60℃
Humidity: 95% RH
Time: 1000 ± 12 Hours
High Temperature
Resistance
Temperature : 85℃±2℃
Time: 1000 ± 12 Hours
Low Temperature
Resistance
Impedance shall be within ±
20% of the initial
value.
Temperature : -40℃±2℃
Time: 1000 ± 12 Hours
1. Operating Temperature Range: -55 ℃ TO +125℃
2. Storage Condition: The temperature should be within -40℃~85℃ and humidity should be less than 75% RH.
The product should be used within 6 months from the time of delivery.
W