Manual

MAG.LAYERS
GMLB-060303-P Series
■
■
■
R
R
R
E
E
E
L
L
L
I
I
I
A
A
A
B
B
B
I
I
I
L
L
L
T
T
T
Y
Y
Y
T
T
T
E
E
E
S
S
S
T
T
T
•MECHANICAL PERFORMANCE TEST
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the terminal electrode shall
be covered with fresh solder.
Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245 ± 5℃
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Soldering Heat
Resistance
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder.
Solder temperature : 260 ± 5℃
Flux: Rosin
Dip time: 10 ± 1 seconds
Bending Strength
The chip shall not crack.
Vibration
Impedance shall be within ± 20% of the initial
value.
There shall be no mechanical damage.
The sample shall be soldered onto the
printed circuit board
and when a vibration
having an amplitude of 1.52mm
and a
frequency of from 10 to 55Hz/1 minute
repeated should
be applied to the 3
directions (X,Y,Z) for 2 hours each.
Drop shock
No apparent damage
Dropped onto printed circuit board from
100cm height three times in x, y, z directions.
The terminals shall be protected.
• CLIMATIC TEST
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Temperature: -55℃~125℃ for 30
minutes each, 100 cycles.
Humidity Resistance
Temperature : 60℃
Humidity: 95% RH
Time: 1000 ± 12 Hours
High Temperature
Resistance
Temperature : 85℃±2℃
Time: 1000 ± 12 Hours
Low Temperature
Resistance
Impedance shall be within ± 20% of the initial
value.
Temperature : -40℃±2℃
Time: 1000 ± 12 Hours
1. Operating Temperature Range: -55 ℃ TO +125℃
2. Storage Condition: The temperature should be within -40℃~85℃
and humidity should be less than
75% RH. The product should be used within 6 months from the time of delivery.