User`s manual

775-Land Package Removal

1. Open the Load Plate/Lever with both hands:

With left hand index finger and thumb to support the

load plate edge, engage PnP cap with right hand thumb

and peel the cap from LGA775 Socket while pressing

on center of PnP cap to assist in removal.

2. Pick up 775-land LGA package:

By Vacuum Pen: Place a minimum 9-mm cup at

approximately the center of IHS.

Recommend not to place Vacuum Pen on IHS edge. Risk of

dropping and causing bent contact.

Recommend not to use Vacuum Pen for inserting CPU By

Hand: Index finger to hold load plate hinge

side and thumb to hold load lever side

3. Lift the package straight up and away.

4. Assemble processors land side cover immediately to

prevent contamination.

i. While holding the processor by the 3 corners, the other

hand lift land side cover from work surface by grasping

at the large retention tabs. Ensure retention tabs and

package are pointing each other.

ii. Orientate so that land side cover chamfer is matching

with package Pin 1 location.

iii. Hook the first large retention tab on the package

substrate. Then press the opposite tab onto the

substrate.

iv. Place processor with land side cover installed onto

proper shipping media or other ESD approved work

surface

Chamfer on Land Side

Cover (align this with

pin 1 mark on 775-land

LGA package)

Large Retention Tabs

(pointing towards user)

Hold at corners