User`s manual

3.3 Hardware Conﬁguration

2) Wearing clean gloves, pick up the GRAFOIL pad. Do not do this

with bare hands because skin oils can be transferred to the pad.

3) Place the GRAFOIL pad on the gold-plated slug surface and align

it with the threaded studs.

b. Attach the microprocessor heat sink. The heat sink material is clear

anodized, hot-water-sealed, 6061-T6 aluminum. The nut material is

2011-T3 aluminum (this grade is critical). Perform the following steps

to attach the heat sink:

1) Observe antistatic precautions.

2) Align the heat sink holes with the threaded studs on the ceramic

package.

3) Handle the heat sink by the edges and lower it on to the chip

package, taking care not to damage the stud threads.

4) Set a calibrated torque driver to 20 in-lb, 2 in-lb, (2.3 N m,

0.2 N m.) The torque driver should have a mounted 7/16-in

socket.

5) Insert a nut into the 7/16-in socket, place on one of the studs, and

tighten to the speciﬁed torque. Repeat for second nut.

6) If the sink/chip/fan clip is used, install it properly by positioning

it over the assembly and hooking its ends around the ZIF socket

retainers.

c. Perform the following steps to attach the heat sink fan assembly:

1) Place the fan assembly on top of the heat sink, aligning the fan

mounting holes with the corresponding threaded heat sink holes.

Align the fan so that the fan power/sensor wires exit the fan closest

to connector J30 (see Figure 2–3). Fan airﬂow must be directed

into the heat sink (fan label facing down toward the heat sink).

2) Place the fan guard on top of the fan. Orient the guard so that the

corner mounting areas lay ﬂush against the heat sink.

3) Secure the fan and fan guard to the heat sink with four

6–32 0.875-in screws.

4) Plug the fan power/sensor cable into connector J30 (see

Figure 2–3).

Starting and Using the EB164 3–5