User`s manual

3.3 Hardware Configuration
Refer to Figure 3–1 for heat sink and fan assembly details.
Figure 3–1 Fan/Heat Sink Assembly
21164 Alpha Microprocessor
LJ04412A.AI5
Heat Sink, with Fan
Mounting Holes
Nut, Hex, 1/4-20, 2011-T3
Aluminum, 0.438 in Across
Flats, Qty 2
Torque to 20 +/- 2 in-lbs
Clip, Heat Sink/Chip/Fan
Thermal Pad
Guard, Fan
Screw, 6-32 x 0.875 in
Qty 4
Fan
a. Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used
to improve the thermal conductivity between the chip package and the
heat sink by replacing micro air pockets with a less insulative material.
Perform the following steps to position the GRAFOIL pad:
1) Perform a visual inspection of the package slug to ensure that it is
free of contamination.
3–4 Starting and Using the EB164