Digital Semiconductor 21164 Alpha Microprocessor Motherboard User’s Manual Order Number: EC–QLJLC–TE Revision/Update Information: Digital Equipment Corporation Maynard, Massachusetts This document supersedes the Alpha 21164 Microprocessor Motherboard User’s Manual (EC–QLJLB–TE).
March 1996 Possession, use, or copying of the software described in this publication is authorized only pursuant to a valid written license from Digital or an authorized sublicensor. While Digital believes the information included in this publication is correct as of the date of publication, it is subject to change without notice.
Contents About This Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii 1 Introduction to the EB164 1.1 1.1.1 1.1.2 1.1.3 1.1.4 1.1.5 1.1.6 1.1.7 1.1.8 1.2 System Components and Features . . . . . . . . . . . . . . Digital Semiconductor 21171 Core Logic Chipset Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . L3 Bcache Subsystem Overview . . . . . . . . . . . . . PCI Interface Overview . . . . . . . . . . . . . . . . . . . ISA Interface Overview .
Functional Description 4.1 4.1.1 4.1.2 4.2 4.3 4.4 4.5 4.5.1 4.5.2 4.5.3 PCI Interrupts and Arbitration Interrupts . . . . . . . . . . . . . Arbitration . . . . . . . . . . . . . ISA Bus Devices . . . . . . . . . . . . dc Power Distribution . . . . . . . PCI Devices . . . . . . . . . . . . . . . Flash ROM . . . . . . . . . . . . . . . . Special ROM Header . . . . . Flash ROM Structure . . . . . Flash ROM Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–1 3–2 4–1 4–2 4–3 4–4 5–1 Fan/Heat Sink Assembly . . . . . . . . . . . . EB164 Power Connectors . . . . . . . . . . . . Interrupt Logic . . . . . . . . . . . . . . . . . . . . Interrupt and Interrupt Mask Registers dc Power Distribution . . . . . . . . . . . . . . Special Header Content . . . . . . . . . . . . . Board Component Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
About This Manual This manual describes Digital Semiconductor’s 21164 Alpha microprocessor motherboard (EB164), a module for computing systems based on the 21164 Alpha microprocessor and the Digital Semiconductor 21171 chipset. Audience This manual is intended for users of the EB164 to assist them in installing the EB164 and populating it with memory modules and peripheral cards. Scope This manual describes the features, configuration, and installation of the EB164.
• Chapter 5, EB164 Requirements, Power, and Parameters, describes the EB164 power and environmental requirements, and identifies major board components. • Appendix A, Supporting Vendor Products, lists suggested vendor sources for supporting components, such as, power supply, SIMMs, enclosure, and so forth.
1 Introduction to the EB164 This chapter provides an overview of the EB164 motherboard and describes the EB164, its components, features, and uses. 1.1 System Components and Features The EB164 is implemented in industry-standard parts and uses a Digital Semiconductor 21164 Alpha microprocessor (21164) running at 266, 300, or 333 MHz. The functional components are shown in Figure 1–1 and are introduced in the following subsections. 1.1.
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1.1 System Components and Features 1.1.2 Memory Subsystem The dynamic random-access memory (DRAM) provides 32MB to 512MB with a 256-bit data bus. The memory is contained in one bank of eight commodity single inline memory modules (SIMMs). Single- or double-sided SIMMs may be used. Each SIMM is 36 bits wide, with 32 data bits and 4 check bits, with 70 ns or less access. Table 1–1 lists the SIMM sizes supported and the corresponding main memory size for 256-bit arrays.
1.1 System Components and Features 1.1.5 ISA Interface Overview The ISA bus has two dedicated slots and a third shared ISA/PCI slot. It provides the following system support functions: • Mouse and keyboard controller functions—provided by an Intel 8242 chip. • An IDE interface, a diskette controller, two universal asynchronous receiver–transmitters (UARTs) with full modem control, and a bidirectional parallel port—provided by a National 87312 combination chip.
1.1 System Components and Features 1.1.7 Software Support Software support code, consisting of a debug monitor and Windows NT ARC firmware is contained in a 1MB flash ROM. The monitor provides functions that allow you to: • Download files through serial and Ethernet ports and diskette. • Load data from a ROM through the debug monitor. • Examine and deposit the EB164 system registers, a few 21164 internal processor registers (IPRs), and I/O mapped registers.
1.1 System Components and Features Figure 1–2 Board Component Layout 33.15 cm (13.05 in) 1 1 7 1 8 3 4 6 5 9 2 10 30.73 cm (12.10 in) 14 11 1 12 13 16 17 15 18 19 20 1 21 MK−2306−32 1.2 EB164 Summary The features of the EB164 are listed and described in Table 1–2.
1.2 EB164 Summary Table 1–2 EB164 Features Summary Characteristic Description Operating Systems Supported operating systems Microsoft Windows NT. For information on Digital UNIX operating system support, see your local distributor or your Digital sales representative.
1.2 EB164 Summary Table 1–2 (Cont.
2 System Configuration and Connectors The EB164 uses jumpers to implement configuration parameters such as variations in backup cache (Bcache) size, access timing, and speed, as well as boot parameters. These jumpers must be configured for the user’s environment. Onboard connectors are provided for the I/O interfaces, single inline memory modules (SIMMs), and serial and parallel peripheral ports. After the module is configured, power can be applied, and the debug monitor can be run.
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2.1 Configuration Jumpers Table 2–1 Configuration Jumper Position Descriptions Feature Jack/Jumper—Pins and Description System clock divisor J1—1/2, —3/4, —5/6, —7/8 J1—1/2 (irq3) J1—3/4 (irq2) J1—5/6 (irq1) J1—7/8 (irq0) In In Out Out 3 In Out In In 4 In Out In Out 5 In Out Out In 6 In Out Out Out 7 Out In In In 8 Out In Ratio Divisor 8 is used for 266 MHz. In Out 9 Divisor 9 is used for 300 MHz.
2.1 Configuration Jumpers Table 2–1 (Cont.) Configuration Jumper Position Descriptions Feature Jack/Jumper—Pins and Description BC_SIZE<2:0> J1—11/12 (CONF4), —13/14 (CONF5), —15/16 (CONF6) These jumpers allow the Bcache to emulate the sizes specified in the following table. These jumpers are changed in conjunction with the appropriate index jumpers J17, J16, and J15.
2.1 Configuration Jumpers Table 2–1 (Cont.) Configuration Jumper Position Descriptions Feature Jack/Jumper—Pins and Description BC_SPEED<2:0> J1—17/18 (CONF7), —19/20 (CONF8), —21/22 (CONF9) These jumpers select the Bcache timing parameters used to compute the BC_CONFIG register value. Select the jumper configuration that matches the access time for the SRAMs being used.
2.1 Configuration Jumpers Table 2–1 (Cont.) Configuration Jumper Position Descriptions Feature Jack/Jumper—Pins and Description BOOT_OPTION J1—25/26 (CONF11) This jumper selects the image to be loaded into memory from the system flash ROM. With the jumper out (bit = 1), the first image (debug monitor) is loaded. With the jumper in (bit = 0), alternate images can be loaded depending upon the value stored in TOY RAM location 0x3F. The default position for this jumper is in.
2.2 EB164 Connectors 2.2 EB164 Connectors Figure 2–3 shows the EB164 connectors and Table 2–2 describes them. Figure 2–4 provides a detail of header connector J2.
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2.2 EB164 Connectors Table 2–2 EB164 Connector Descriptions Connector Pins Description Main Memory/Bcache SIMMs J10 72 DRAM 0 SIMM J9 72 DRAM 1 SIMM J8 72 DRAM 2 SIMM J7 72 DRAM 3 SIMM J6 72 DRAM 4 SIMM J5 72 DRAM 5 SIMM J4 72 DRAM 6 SIMM J3 72 DRAM 7 SIMM Note: To fill a 256-bit data path, all SIMM connectors J3 through J10 must be populated. J11 60 Bcache 0 SIMM J12 60 Bcache 1 SIMM Note: Both Bcache SIMM connectors must be populated.
2.2 EB164 Connectors Table 2–2 (Cont.) EB164 Connector Descriptions Connector Pins Description Mouse Connector J34 6 Mouse connector National 87312 Combination Chip Connectors J33 26 Parallel port connector Connects to an external 25-pin connector. J27 10 Serial communication port 1 connector Note: This connector can be used as a terminal port for the debug monitor.
2.2 EB164 Connectors Table 2–2 (Cont.) EB164 Connector Descriptions Connector Pins Description Speaker J2—19/21/23/25 — Speaker connector pins Power On Indicator J2—26 1 Power on indicator pin Connect LED from this pin to ground.
2.2 EB164 Connectors Table 2–2 (Cont.) EB164 Connector Descriptions Connector Pins Description Power Connectors J18 12 Board power connector Pin Voltage/Signal 1 +3.3 V 2 +3.3 V 3 +3.3 V 4 Ground 5 Ground 6 Ground 7 Ground 8 Ground 9 Ground 10 +3.3 V 11 +3.3 V 12 +3.
2.2 EB164 Connectors Table 2–2 (Cont.) EB164 Connector Descriptions Connector Pins Description J29 12 Board power connector Pin Voltage/Signal 1 p_dcok 2 Vdd (+5 V) 3 +12 V 4 –12 V 5 Ground 6 Ground 7 Ground 8 Ground 9 –5 V 10 Vdd (+5 V) 11 Vdd (+5 V) 12 Vdd (+5 V) Note: Power for the EB164 is provided by a user-supplied power supply. Digital does not provide this power supply. (Refer to Chapter 5 for more information.
3 Starting and Using the EB164 This chapter lists hardware, software, and accessories that users must obtain to completely furnish a functioning computer system. The chapter then describes how to configure the hardware and software. Finally, the chapter describes how to start and use the EB164. 3.1 Hardware Requirements Before turning on the power to your EB164, you must provide the following components in addition to those supplied in the kit.
3.1 Hardware Requirements • A 3.5-in diskette drive and cable. • A 9-pin serial line cable. • A terminal or a serial line connection to a host system with appropriate cables. Refer to the Alpha Microprocessors Evaluation Board Windows NT 3.51 Installation Guide provided in the EB164 Windows NT 3.51 Installation Kit and the Hardware Compatibility List for Windows NT to determine which SCSI controllers and graphics cards are supported.
3.3 Hardware Configuration 1. Install the 21164 Alpha microprocessor in ZIF socket U42. a. Observe antistatic precautions. b. Lift the ZIF socket actuator handle to a full 90° angle. c. Make sure that all the pins on the 21164 are straight. d. The ZIF socket and 21164 are keyed to allow for proper installation. Align the 21164, with its missing AD01 pin, with the corresponding plugged AD01 position on the ZIF socket. Gently lower into position. e.
3.3 Hardware Configuration Refer to Figure 3–1 for heat sink and fan assembly details. Figure 3–1 Fan/Heat Sink Assembly Screw, 6-32 x 0.875 in Qty 4 Guard, Fan Fan Clip, Heat Sink/Chip/Fan Nut, Hex, 1/4-20, 2011-T3 Aluminum, 0.438 in Across Flats, Qty 2 Torque to 20 +/- 2 in-lbs Heat Sink, with Fan Mounting Holes Thermal Pad 21164 Alpha Microprocessor LJ04412A.AI5 a. Put the GRAFOIL thermal pad in place.
3.3 Hardware Configuration 2) Wearing clean gloves, pick up the GRAFOIL pad. Do not do this with bare hands because skin oils can be transferred to the pad. 3) Place the GRAFOIL pad on the gold-plated slug surface and align it with the threaded studs. b. Attach the microprocessor heat sink. The heat sink material is clear anodized, hot-water-sealed, 6061-T6 aluminum. The nut material is 2011-T3 aluminum (this grade is critical).
3.3 Hardware Configuration 4. Install the two L3 cache SRAM SIMMs into sockets J11 and J12. Refer to Table 2–2 for socket locations. 5. Install eight system memory DRAM SIMMs. Refer to Table 2–2 for socket locations. a. Observe antistatic precautions. Handle SIMMs at the edges only to prevent damage. b. SIMMs must be installed in groups of eight consisting of identical devices. c. Hold the SIMM at an angle with the notch facing the key in the socket. d.
3.3 Hardware Configuration Figure 3–2 EB164 Power Connectors EB164 Board J29 1 J29 Pin Voltage/Signal p_dcok 1 Vdd (+5 V) 2 3 +12 V 4 −12 V 5 Ground 6 Ground 7 Ground 8 Ground 9 −5 V Vdd (+5 V) 10 Vdd (+5 V) 11 Vdd (+5 V) 12 21164 Microprocessor J18 1 J18 Pin 1 2 3 4 5 6 7 8 9 10 11 12 Voltage/Signal +3.3 V +3.3 V +3.3 V Ground Ground Ground Ground Ground Ground +3.3 V +3.3 V +3.
3.3 Hardware Configuration 11. If you will be using an IDE hard drive, attach your IDE cable to connector J28 in the proper orientation and install your hard drive. The disk should be configured as the primary device on the IDE bus. Refer to the manufacturer’s instructions for setting up the hard drive. 12. If you plan to use your EB164 on a network, install the Ethernet controller board (DE435) in one of the PCI connectors as outlined in the DE435 documentation. 13.
3.4 Software Configuration 3.4.1 Starting Windows NT ARC Firmware Start the Windows NT ARC firmware using the following procedure. 1. Verify that the jumper from J14-2 to J14-3 is inserted, allowing the flash ROM to be written. If the Windows NT ARC firmware is unable to write to flash ROM, it prints the device error message and stops. 2. Verify that the jumper at J1–25/26 is installed (see CONF11 on the module).
3.4 Software Configuration 3.4.3 Returning to Windows NT ARC Firmware from the Debug Monitor The following methods may be used to return to the Windows NT ARC firmware from the debug monitor. A. If you used item A in section Section 3.4.2 to enter the debug monitor, then use this procedure to return to Windows NT ARC firmware. The firmware contained in the serial ROM on your EB164 determines which firmware image is loaded from the flash ROM at power-up.
3.4 Software Configuration B. If you used item B in section Section 3.4.2 to enter the debug monitor, then use this procedure to return to Windows NT ARC firmware. 1. Turn off the power to the EB164, insert the jumper from J1-25/26 (CONF11 on the module). 2. Turn on the power to the EB164. After the power-up diagnostics are run, the ARC console boot menu appears on the graphics display.
4 Functional Description This chapter describes the functional operation of the EB164. The description introduces the Digital Semiconductor 21171 ASIC support chipset and describes its implementation with the 21164 microprocessor, its supporting memory, and I/O devices. Figure 1–1 shows the EB164 major functional components. Information, such as bus timing and protocol, found in other data sheets and reference documentation is not duplicated.
4–2 Functional Description eb164.26 eb164.32 irq<15:3 ,1> <12, 1> sio_int pci_isa_irq <7:3> eb164.27 Combination Controller Ubus<7:0> eb164.30 System Interrupt PLD Keyboard and Mouse Controller drq<7:5, 3:0> irq_reset_l ISA Bus Decodes sense_dis pci_int xn _l ISA Slots eb164.20−.22 PCI Slots PCI Bus eb164.25 PCI−to−ISA Bridge eb164.8 Control, I/O Interface, and Address eb164.
4.1 PCI Interrupts and Arbitration The PCI-to-ISA SIO bridge chip provides the functionality of two 8259 interrupt control devices. These ISA-compatible interrupt controllers are cascaded such that 14 external and two internal interrupts are available. The PCI interrupt acknowledge command should be used to read the interrupt request vector from the SIO. However, the EB164 has more interrupt signals than the 14 external interrupts the SIO can handle.
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4–6 Functional Description 12 11 10 9 8 7 6 5 4 3 2 1 J18 12 11 10 9 8 7 6 5 4 3 2 J29 eb164.40 Power Connectors +3 V eb164.26 ISA Conn. GND (Vss) −5 V +12 V −12 V Vdd eb164.22 PCI32 Conn. Spkr +3 V Pull−Ups Pull−Downs +5 V Pull−Ups Integrated Circuits/Clocks Flash ROM Fan MK−2306−25 eb164.2 21164 P/J30 Fans (J1) 4.
4.3 dc Power Distribution As shown in Figure 4–3, the +12 V dc, –12 V dc, and –5 V dc are supplied to ISA connectors J19, J20, and J21. The +12 V dc and –12 V dc are supplied to ISA connectors and PCI32 connectors J24 and J25. The +12 V dc is also supplied to the CPU fan connector J30, auxiliary fan connector pins on header J2, and to the flash ROM write-enable conector J14. Vdd is supplied to ISA connectors, PCI32 connectors and most of the board’s integrated circuits.
4.5 Flash ROM 4.5 Flash ROM The flash ROM, sometimes called the system ROM, is a 1MB, nonvolatile, writable ROM. After the serial ROM (SROM) code initializes the EB164 system, the flash ROM code prepares the system for booting. The flash ROM headers, structure, and access methods are described here. 4.5.1 Special ROM Header The MAKEROM tool is used to place a special header on ROM image files. The SROM allows the system (flash) ROM to contain several different ROM images, each with its own header.
4.5 Flash ROM Table 4–3 describes each entry in the special header. Table 4–3 Special Header Entry Descriptions Entry Description Validation and inverse validation pattern This quadword contains a special signature pattern used to validate that the special ROM header has been located. The pattern is 5A5AC3C3A5A53C3C. Header size (bytes) This longword provides the size of the header block, which varies among versions of the header specification.
4.5 Flash ROM Table 4–3 (Cont.) Special Header Entry Descriptions Entry Description Header revision The revision of the header specification used in this header. This is necessary to provide for changes to the header specification. Version 0 headers are identified by the size of the header (32 bytes). Flash ROM image size The flash ROM image size reflects the size of the image as it is contained in the flash ROM.
4.5 Flash ROM 4.5.2 Flash ROM Structure During the power-up and initialization sequence, the EB164 always loads the first image if BOOT_OPTION=1 (jumper J1—25/26 not installed). Then the first image (the debug monitor) will be booted. If jumper J1—25/26 (BOOT_OPTION) is installed (see Figure 2–2), the EB164 reads the value at location 0x3F of the TOY RAM. The EB164 uses the value found there to determine which image will be selected (see Table 4–4). The selected image is loaded and executed.
4.5 Flash ROM Changing TOY RAM Location 0x3F—Debug Monitor bootopt Command Use the debug monitor bootopt command to change the value in location 3F. In the example shown here, the bootopt command is used to change the value in location 3F from 0 to 1: EB164> bootopt ! Predefined bootoptions are... "0" "Alpha Evaluation Board Debug Monitor" "DBM" "1" "The Windows NT Operating System" "NT" "2" "OpenVMS" "VMS" "3" "Digital UNIX" "UNIX" O/S type selected: "Alpha Evaluation Board Debug Monitor" ....
4.5 Flash ROM 4.5.3 Flash ROM Access The flash ROM can be viewed as two banks of 512KB each. At power-up the lower 512KB bank is accessed using the address range 86.FFF8.0000 to 86.FFFF.FFFF. Setting address bit 19 (flash_adr19) allows you to access the higher 512KB of flash ROM. Write a 1 to the register at address 0x800 to set address bit 19. Manually deposit a 1 to address 0x800 or enter the following command from the debug monitor: > wb 800 1 The address range for the higher bank is 86.FFF8.0000 to 86.
5 EB164 Requirements, Power, and Parameters This chapter describes the EB164 environmental requirements, power, and physical board parameters. 5.1 Power Requirements The EB164 derives its main dc power from a user-supplied power supply. The board has a total power dissipation of 116 W, excluding any plug-in PCI and ISA devices. Table 5–1 lists the power requirement for each dc supply voltage. The power supply must supply a dcok signal to the system reset logic.
5.2 Environmental Requirements 5.2 Environmental Requirements The 21164 microprocessor is cooled by a small fan blowing directly into the chip’s heat sink. The EB164 motherboard is designed to run efficiently using only this fan. Additional fans may be necessary depending upon cabinetry and I/O board requirements.
5.3 Physical Board Parameters Figure 5–1 Board Component Layout 33.15 cm (13.05 in) 1 1 7 1 8 3 4 6 5 9 2 10 30.73 cm (12.
5.3 Physical Board Parameters Table 5–2 Board Component List Locator Number Component Number Component Description 1 U42 Digital Semiconductor 21164 Alpha microprocessor 2 U41 21171-CA control, I/O interface, and address (CIA) chip 3 U32 21171-BA data switch (DSW0) chip 4 U15 21171-BA data switch (DSW2) chip 5 U10 21171-BA data switch (DSW1) chip 6 U2 21171-BA data switch (DSW3) chip 7 U50 TriQuint TQ2061 phase-locked loop (PLL) clock chip 8 U49 26.
A Supporting Vendor Products To obtain components and accessories that are not included with your EB164 motherboard, Digital Equipment Corporation suggests the following vendors. In doing so, Digital does not warrant these components or guarantee that they will function in all configurations. A.1 Products Included The following products are included in the EB164 motherboard kit. • Alpha microprocessor clock solution.
A.1 Products Included • Bcache (Level 3) cache SIMMs Cache Size SIMM Configuration Qty 2MB @10 ns 128K 2 80 2 Vendor/Part Number Digital PN, 21A04-M1 A.2 Products Not Included The following products are not included in the EB164 motherboard kit. • DRAM system memory—70 ns DRAM SIMMs (5 V, 72 pin) 1M 2 36, 2M 2 36, 4M 2 36, 8M 2 36, 16M 2 36. Note The DRAM SIMMs must be n • 2 36 SIMMs. Power supply—+3.3 V, +5 V, –5 V, +12 V, –12 V, available from: Emacs Electronics USA, Inc.
B Technical Support and Ordering Information B.1 Obtaining Technical Support If you need technical support or help deciding which literature best meets your needs, call the Digital Semiconductor Information Line: United States and Canada Outside North America 1–800–332–2717 +1–508–628–4760 B.2 Ordering Digital Semiconductor Products To order the EB164, contact your local distributor. The following table lists some of the semiconductor products available from Digital.
B.3 Ordering Digital Semiconductor Literature B.3 Ordering Digital Semiconductor Literature The following table lists some of the available Digital Semiconductor literature. For a complete list, contact the Digital Semiconductor Information Line.
B.4 Ordering Third-Party Literature B.4 Ordering Third-Party Literature You can order the following third-party literature directly from the vendor: Title Vendor PCI System Design Guide PCI Special Interest Group 1–800–433–5177 (U.S.) 1–503–797–4207 (International) 1–503–234–6762 (FAX) PCI Local Bus Specification, Rev 2.1 PCI Special Interest Group (See previous entry.) 82420/82430 PCIset ISA and EISA Bridges (includes 82378IB/ZB SIO) PN 290483 Intel Corporation Literature Sales P.O. Box 7641 Mt.
Index A C Airflow requirements, 5–2 Alpha documentation, B–2 Arbitration scheme, 4–5 Associated literature, B–2 Cache See Bcache 21171 chipset, 1–1 Chipset support, 1–1 Clock divisor jumper, 2–4 COM1 connector, 2–11 COM2 connector, 2–11 Components See System components Configuration, 2–1 to 2–14 hardware, 3–2 software, 3–8 Configuration jumpers, 2–1 Connectors, 2–8 Bcache SIMM, 2–10 CPU fan power, 2–14 CPU fan sensor, 2–14 debug monitor interface, 2–11 diskette, 2–11 DRAM SIMM, 2–10 IDE drive, 2–11 ISA b
Conventions, viii Cooling fan, CPU power connectors, 2–14 sensor connector, 2–14 Current dc ampere requirements, 5–1 D dc power distribution, 4–5 See also Power requirements dc power requirements, 5–1 Debug and monitor ROM system support, 1–5 Debug monitor, 3–8 interface connector, 2–11 Digital Semiconductor 21171 chipset, 1–1 Diskette drive, 1–8 connector, 2–11 controller, 1–4 hardware requirement, 3–2 installation, 3–6 Documentation, B–2 DRAM SIMM connectors, 2–10 Dynamic RAM See DRAM E Environmental re
ISA (cont’d) devices, 4–5 interface overview, 1–4 J Jumpers, 2–1 Bcache index, 2–5 Bcache size, 2–4 Bcache speed, 2–5 BC_RD_FAST, 2–7 boot option, 2–6 Flash ROM write-protect/write-enable, 2–7 Mini-Debugger, 2–6 system clock divisor, 2–4 system configuration, 2–1 K Keyboard connector, 2–10 lock switch, 2–12 L L3 cache See Bcache Level 3 cache See Bcache Literature, B–2, B–3 M Memory SIMM connectors, 2–10 Memory subsystem, 1–3 See also DRAM Mini-Debugger connector, 2–11 jumper, 2–6 Mouse connector, 2–11
S Saturn I/O chip See SIO chip Semiconductor Information Line, B–1 Serial interface connectors, 2–11 Serial ROM See SROM SIMM connectors, 2–10 Single inline memory module See SIMM SIO chip, 1–3, 4–3, B–3 Software requirements, 3–2 Software support, 1–5 Speaker connection pins, 2–12 SRAM, 1–3, 2–6, 2–10, 3–1, 3–6 SROM code, 1–5 connector, 2–11 system support, 1–5 Static RAM See SRAM Support chipset, 1–1 System components, 1–1 System enclosure fan power connectors, 2–11 System features, 1–1 Index–4 System I
