User`s guide

i.MX53 Layout Recommendations
i.MX53 System Development User’s Guide, Rev. 1
2-2 Freescale Semiconductor
Figure 2-2. i.MX53 Package Information
Maintaining the recommended footprint of a 12 mils pad, which allows an air gap of 19.5-mils between
pads, is critical for ease of fanout.
If using the Allegro tool, optimal practice is to use the footprint as created by Freescale. If not using the
Allegro tool, use the Allegro footprint export feature (supported by many tools). If export is not possible,
create the footprint as per the package mechanical dimensions outlined in the product data sheet.