Datasheet
Table Of Contents
- General Description
- Features
- Ordering Information
- Applications
- Key Specifications
- Functional Description
- Figure 2 Functional Block Diagram
- Image Sensor Array
- Analog Amplifier
- 10-Bit A/D Converters
- Channel Balance
- Black Level Compensation
- Windowing
- Timing Generator and Control Logic
- Digital Signal Processor (DSP)
- Output Formatter
- Compression Engine
- Microcontroller
- SCCB Interface
- Strobe Mode
- Reset
- Power Down Mode
- Digital Video Port
- Pin Description
- Electrical Characteristics
- Timing Specifications
- Figure 13 SCCB Interface Timing Diagram
- Table 9 SCCB InterfaceTiming Specifications
- Figure 14 UXGA, SVGA, and CIF Line/Pixel Output Timing
- Table 10 Pixel Timing Specifications
- Figure 15 UXGA Frame Timing
- Figure 16 SVGA Frame Timing
- Figure 17 CIF Mode Frame Timing
- Figure 18 Frame Exposure Mode Timing with EXPST_B Staying Low
- Figure 19 Frame Exposure Mode Timing with EXPST_B Asserted
- Table 11 Frame Exposure Timing Specifications
- OV2640 Light Response
- Register Set
- Package Specifications
- Revision History
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ision
DESCRIPTION OF CHANGES (CONTINUED)
• In Figure 21 on page 28, changed callout C3 to measure from thickness of glass and added
callout C4 to measure airgap from glass to die.
• In Table 14 on page 28, changed C3 parameter name from “Thickness of Glass Surface to
Wafer” to “Cover Glass Thickness”
• In Table 14 on page 28, changed C3 Minimum, Nominal, and Maximum specifications
from “425, 445, and 465” to “375, 400, and 425”
• In Table 14 on page 28, added C4 parameter, Airgap Between Cover Glass and Sensor,
and Minimum, Nominal, and Maximum specifications “30, 45, and 60”, respectively