Datasheet
Table Of Contents
- General Description
- Features
- Ordering Information
- Applications
- Key Specifications
- Functional Description
- Figure 2 Functional Block Diagram
- Image Sensor Array
- Analog Amplifier
- 10-Bit A/D Converters
- Channel Balance
- Black Level Compensation
- Windowing
- Timing Generator and Control Logic
- Digital Signal Processor (DSP)
- Output Formatter
- Compression Engine
- Microcontroller
- SCCB Interface
- Strobe Mode
- Reset
- Power Down Mode
- Digital Video Port
- Pin Description
- Electrical Characteristics
- Timing Specifications
- Figure 13 SCCB Interface Timing Diagram
- Table 9 SCCB InterfaceTiming Specifications
- Figure 14 UXGA, SVGA, and CIF Line/Pixel Output Timing
- Table 10 Pixel Timing Specifications
- Figure 15 UXGA Frame Timing
- Figure 16 SVGA Frame Timing
- Figure 17 CIF Mode Frame Timing
- Figure 18 Frame Exposure Mode Timing with EXPST_B Staying Low
- Figure 19 Frame Exposure Mode Timing with EXPST_B Asserted
- Table 11 Frame Exposure Timing Specifications
- OV2640 Light Response
- Register Set
- Package Specifications
- Revision History
O
mni
TM
ision
REVISION CHANGE LIST
Document Title: OV2640 Datasheet Version: 1.1
DESCRIPTION OF CHANGES
The following changes were made to version 1.01:
• Under Features on page 1, changed bulleted item from “Supports image sizes: UXGA,
SVGA, and any size scaling down from SVGA to 40x30” to “Supports image sizes:
UXGA, SXGA, SVGA, and any size scaling down from SXGA to 40x30”
• Under Key Specifications on page 1, deleted specifications for SVGA and CIF Array Size
• Under Key Specifications on page 1, changed Standby Power Requirements specification
to “TBD”
• Under Key Specifications on page 1, changed specification for Chief Ray Angle from
“TBD” to “25° non-linear”
• Under Key Specifications on page 1, changed specification for Well Capacity from
“TBD” to “12 Ke”
• Under Electrical Characteristics on page 10, changed title of Table 6 from “DC
Characteristics (-20°C < T
A
< 70°C)” to “DC Characteristics (-30°C < T
A
< 70°C)”
• In Table 6 on page 10, changed specification for Typ Standby Current from “10” to
“TBD”
• In Table 6 on page 10, changed specification for Max Input voltage LOW (V
IL
) from
“0.8” to “0.54”
• In Table 6 on page 10, changed specification for Min Input voltage HIGH (V
IH
) from “2”
to “1.26”
• In Table 6 on page 10, changed subtitle “Digital Outputs (standard loading 25 pF, 1.2 KΩ
to 2.8V)” to “Digital Outputs (standard loading 25 pF)”
• In Table 6 on page 10, changed specification for Min Output voltage HIGH (V
OH
) from
“2.2” to “1.62”
• In Table 6 on page 10, changed specification for Max Output voltage LOW (V
OL
) from
“0.6” to “0.18”
• In Table 6 on page 10, changed specification for Serial Interface Inputs Max SIO_C and
SIO_D (V
IL
) from “1” to “0.54”
• In Table 6 on page 10, changed specification for Serial Interface Inputs Min, Typ, and
Max SIO_C and SIO_D (V
IH
) from “2.5, 2.8, and VDD-IO + 0.5” to “1.26, 1.8, and 2.3”,
respectively
• In Table 6 on page 10, changed table footnote b from “...V
DD-IO
= 2.8V” to
“...V
DD-IO
= 1.8V”