Datasheet
Table Of Contents
- General Description
- Features
- Ordering Information
- Applications
- Key Specifications
- Functional Description
- Figure 2 Functional Block Diagram
- Image Sensor Array
- Analog Amplifier
- 10-Bit A/D Converters
- Channel Balance
- Black Level Compensation
- Windowing
- Timing Generator and Control Logic
- Digital Signal Processor (DSP)
- Output Formatter
- Compression Engine
- Microcontroller
- SCCB Interface
- Strobe Mode
- Reset
- Power Down Mode
- Digital Video Port
- Pin Description
- Electrical Characteristics
- Timing Specifications
- Figure 13 SCCB Interface Timing Diagram
- Table 9 SCCB InterfaceTiming Specifications
- Figure 14 UXGA, SVGA, and CIF Line/Pixel Output Timing
- Table 10 Pixel Timing Specifications
- Figure 15 UXGA Frame Timing
- Figure 16 SVGA Frame Timing
- Figure 17 CIF Mode Frame Timing
- Figure 18 Frame Exposure Mode Timing with EXPST_B Staying Low
- Figure 19 Frame Exposure Mode Timing with EXPST_B Asserted
- Table 11 Frame Exposure Timing Specifications
- OV2640 Light Response
- Register Set
- Package Specifications
- Revision History
Package Specifications
Version 1.6, February 28, 2006 Proprietary to OmniVision Technologies 29
O
mni ision
Package Specifications
The OV2640 uses a 38-ball Chip Scale Package 2 (CSP2). Refer to Figure 11 for package information, Table 9 for package
dimensions and Figure 12 for the array center on the chip.
Figure 21 OV2640 Package Specifications
Note: For OVT devices that are lead-free, all part marking letters are
lower case. Underlining the last digit of the lot number indicates CSP2 is
used.
Table 14 OV2640 Package Dimensions
Parameter Symbol Minimum Nominal Maximum Unit
Package Body Dimension X A 5700 5725 5750 µm
Package Body Dimension Y B 6260 6285 6310 µm
Package Height C 845 905 965 µm
Ball Height C1 150 180 210 µm
Package Body Thickness C2 680 725 770 µm
Cover Glass Thickness C3 375 400 425 µm
Airgap Between Cover Glass and Sensor C4 30 45 60 µm
Ball Diameter D 320 350 380 µm
Total Pin Count N 38 (1 NC)
Pin Count X-axis N1 6
Pin Count Y-axis N2 7
Pins Pitch X-axis J1 800 µm
Pins Pitch Y-axis J2 800 µm
Edge-to-Pin Center Distance Analog X S1 833 863 893 µm
Edge-to-Pin Center Distance Analog Y S2 713 743 773 µm
Center of BGA (die) =
Center of the package
Top View (Bumps Down)
C3
C4
Side View
Die
Glass
B
A
D
C
E
F
S1
J1
S2
J2
A
C1
B
156234
Bottom View (Bumps Up)
Part Marking Code:
w
x
y
z
abcd
-
-
-
-
-
OVT Product Version
Year the part is assembled
Month the part is assembled
Wafer number
Last four digits of lot number
621543
C2
C
G
B
A
D
C
E
F
G
abcd
wxyz