Use Instructions
Table Of Contents
- 1 About this document
- 2 Product Overview
- 3 Interface Description
- 3.1 PIN Definition
- 3.2 Operating condition
- 3.3 Digital I/O characteristics
- 3.4 Power Interface
- 3.5 UIM interface
- 3.6 PCM interface(TBD)
- 3.7 USB2.0 interface
- 3.8 UART Interface
- 3.9 Power on/off and reset interface
- 3.10 Interactive interface
- 3.11 Net Light interface
- 3.12 System boot configuration and download
- 3.13 Analog and Digital conversion (ADC) interface
- 3.14 I2C interface
- 3.15 SPI interface
- 3.16 Antenna interface
- 4 Product characteristics
- 5 Design guideline
- 6 Manufacturers
- 7 Package Storage information
- 8 Safety Information
L710HG Hardware Design
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Figure 7-2 Package and ship information
7.2 Bagged storage conditions
L710HG shipments in the form of vacuum sealing anti-static bag. Module of storage need to follow
the following conditions: Environment below 40 Degrees Celsius temperature, air humidity is less
than 90% of cases, the module can be in vacuum sealed bags for 12 months. Conditions set the storage
environment Suggestions with reference to the following form.
Table 7-1 Storage conditions (less than 90% humidity of the air vacuum sealed packaging)
Parameter
Min.
Typ.
Max.
Unit
Storage
temperature
-45 25 90 ℃
When on the vacuum bags, if meet the following conditions, the module can be directly for reflow
soldering (furnace temperature setting reference 6.2 furnace temperature curve) or other high
temperature process:
Module temperature below 30 degrees c, the air humidity is less than 60%, factory within 72
hours to complete the SMT.
The humidity is less than 10%.
If the module is in the following conditions, to be baked before SMT:
When the environment temperature is 23 degrees Celsius (allow upper and lower volatility of 5
degrees Celsius), humidity index greater than 10%.
When open vacuum bags, module temperature below 30 degrees Celsius, air humidity is less than
60%, but the factory have not finished the SMT within 72 hours.