Use Instructions

L710HG Hardware Design
50
6 Mandatory bake before use. After bake, it must be reflowed
within the time limit specified on the label.
After unpacking, <30 degrees in temperature and relative humidity <60% environmental conditions,
168 hours in the SMT patch. If not meet the above conditions need to be baked.
NOTES: For product handling, storage, processing, IPC / JEDEC J-STD-020C must be followed
6.4 Baking Requirements
Due to the humidity sensitive characteristics of the L710HG module, the L710HG is a vacuum
packaging, which can be stored for 6 months without damage to the package, and the ambient
temperature is less than 40 C and the relative humidity is less than 90%. To meet one of the following
conditions, the process of reflow soldering should be performed before the full bake (if trays are used,
please note whether the tray is heat-resistant.), or the module may cause permanent damage to the
process.
1、Vacuum packing damage or leakage
2、The module is exposed in the air for 168 hours or more
3、The module is exposed in air for 168 hours, not meet the temperature <30 degrees and
relative humidity of the environment conditions <60%
Table 6-3 Baking requirements
Baking temperature
Humidity
Baking time
120°C±5°C <5% 4 Hours
Note: The original packaging of the module cannot bear the high temperature of baking. The
packaging needs to be removed before baking, otherwise the packaging will be damaged.