Use Instructions
Table Of Contents
- 1 About this document
- 2 Product Overview
- 3 Interface Description
- 3.1 PIN Definition
- 3.2 Operating condition
- 3.3 Digital I/O characteristics
- 3.4 Power Interface
- 3.5 UIM interface
- 3.6 PCM interface(TBD)
- 3.7 USB2.0 interface
- 3.8 UART Interface
- 3.9 Power on/off and reset interface
- 3.10 Interactive interface
- 3.11 Net Light interface
- 3.12 System boot configuration and download
- 3.13 Analog and Digital conversion (ADC) interface
- 3.14 I2C interface
- 3.15 SPI interface
- 3.16 Antenna interface
- 4 Product characteristics
- 5 Design guideline
- 6 Manufacturers
- 7 Package Storage information
- 8 Safety Information
L710HG Hardware Design
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6.2 Temperature curve
In order to ensure soldering quality, special attention should be paid to the control of temperature
curve pipes. The soldering profile shown below is only a general recommendation and should be
adjusted according to the specific application and manufacturing.
Figure 6-2 The reference temperature curve
6.3 Device moisture-sensitivity level (MSL)
L710HG module complies with the humidity level 3. At a temperature of <30 degrees and relative
humidity of <60% of the environmental conditions, dry pack to perform J-STD-020C specification
according to IPC / JEDEC standard. At a temperature of < 40 degrees and a relative humidity of <
90% of the environmental conditions, in the case of unopened shelf life of at least six months. After
unpacking, Table6-1 shows the module shelf life at different times corresponding to the level of
humidity.
Table 6-2 Moisture sensitivity level and floor life
The Moisture Sensitivity Level
(MSL)
Floor Life(out of bag) at factory ambient≦ +30
/60%RH
1 RH ℃ condition
Unlimited at ≦ +30 /85%
2
1 Year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a
24 hours