Use Instructions
Table Of Contents
- 1 About this document
- 2 Product Overview
- 3 Interface Description
- 3.1 PIN Definition
- 3.2 Operating condition
- 3.3 Digital I/O characteristics
- 3.4 Power Interface
- 3.5 UIM interface
- 3.6 PCM interface(TBD)
- 3.7 USB2.0 interface
- 3.8 UART Interface
- 3.9 Power on/off and reset interface
- 3.10 Interactive interface
- 3.11 Net Light interface
- 3.12 System boot configuration and download
- 3.13 Analog and Digital conversion (ADC) interface
- 3.14 I2C interface
- 3.15 SPI interface
- 3.16 Antenna interface
- 4 Product characteristics
- 5 Design guideline
- 6 Manufacturers
- 7 Package Storage information
- 8 Safety Information
L710HG Hardware Design
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6 MANUFACTURERS ........................................... 48
6.1 Steel mesh design ................................................................................................................................... 48
6.2 Temperature curve ................................................................................................................................. 49
6.3 Device moisture-sensitivity level (MSL) ............................................................................................... 49
6.4 Baking Requirements ............................................................................................................................ 50
7 PACKAGE STORAGE INFORMATION ............................. 51
7.1 Package information .............................................................................................................................. 51
7.1.1 Tape and reel information .............................................. 51
7.1.1 Package information .................................................... 51
7.2 Bagged storage conditions ..................................................................................................................... 52
8 SAFETY INFORMATION ...................................... 54