Use Instructions
Table Of Contents
- 1 About this document
- 2 Product Overview
- 3 Interface Description
- 3.1 PIN Definition
- 3.2 Operating condition
- 3.3 Digital I/O characteristics
- 3.4 Power Interface
- 3.5 UIM interface
- 3.6 PCM interface(TBD)
- 3.7 USB2.0 interface
- 3.8 UART Interface
- 3.9 Power on/off and reset interface
- 3.10 Interactive interface
- 3.11 Net Light interface
- 3.12 System boot configuration and download
- 3.13 Analog and Digital conversion (ADC) interface
- 3.14 I2C interface
- 3.15 SPI interface
- 3.16 Antenna interface
- 4 Product characteristics
- 5 Design guideline
- 6 Manufacturers
- 7 Package Storage information
- 8 Safety Information
L710HG Hardware Design
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6 Manufacturers
6.1 Steel mesh design
At the bottom of the module pad thermal, can be reduced by way of steel mesh
openings, reduce the risk of short circuit between the thermal and the module of the module Pin, have
certain effect;
Module pad thermal welded steel mesh openings are recommended for reference. Figure
6-1 is recommended for steel mesh and size.
Figure 6-1 Steel mesh (unit mm)(detail A)
Note: The direction mark point only for identify the pin 1 position, should not embody in the steel
mesh file.