Use Instructions

L710HG Hardware Design
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between the transfer.
5.4 EMC and ESD design advice
Users should take full account of the EMC problem caused by signal integrity and power integrity in
the design of the whole machine, In the module of the peripheral circuit layout, for power and signal
lines, etc., to maintain the spacing of 2 times line width. Can effectively reduce the coupling between
the signal, so that the signal has a clean, the return path. When the peripheral power supply circuit is
designed, the decoupling capacitor should be placed close to the module power supply pin, High
frequency high speed circuit and sensitive circuit should be far from the edge of PCB, and the layout
of the layout as far as possible to reduce the interference between each other, and the sensitive signal is
protected. The circuit or device that may interfere with the operation of the system board is designed.
This product is embedded in the system board side, design, need to pay attention to the ESD protection,
the key input and output signal interface, such as (U) SIM card interface need to be placed close to the
protection of ESD devices. In addition to the
motherboard side, the user is required to design the structure and PCB layout, ensure that the metal
shield is fully grounded, and set up an unobstructed discharge passage for the electrostatic discharge.
5.5 PCB Recommended land pattern
Recommended at 64 of peripheral signal pads to the module with a length of 1.0 mm. Recommended
PCB pads as shown in below.