Use Instructions
Table Of Contents
- 1 About this document
- 2 Product Overview
- 3 Interface Description
- 3.1 PIN Definition
- 3.2 Operating condition
- 3.3 Digital I/O characteristics
- 3.4 Power Interface
- 3.5 UIM interface
- 3.6 PCM interface(TBD)
- 3.7 USB2.0 interface
- 3.8 UART Interface
- 3.9 Power on/off and reset interface
- 3.10 Interactive interface
- 3.11 Net Light interface
- 3.12 System boot configuration and download
- 3.13 Analog and Digital conversion (ADC) interface
- 3.14 I2C interface
- 3.15 SPI interface
- 3.16 Antenna interface
- 4 Product characteristics
- 5 Design guideline
- 6 Manufacturers
- 7 Package Storage information
- 8 Safety Information
L710HG Hardware Design
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4.2.3 current consumption
The power consumption in suspended mode and without USB connection is listed in the table below.
Table 4-4 working current consumption (VBAT=3.8V)
Power off
Power off current
14uA
PSM
5uA
Sleep/Idle
GSM Sleep mode typical：1.72mA
Idle mode typical：TBD
EDRX（ EDRX value=81.92s、
Paging Time
window=2.56s,小循环 1.28s）
Sleep mode typical：0.63mA
Idle mode typical：TBD
DRX(2.56s) Sleep mode typical：1.05mA
Idle mode typical：TBD
Data transmission
LTE-FDD B1 @200KHzbps typical：TBD
@1.4MHz typical：TBD
LTE-FDD B3 @200KHzbps typical：TBD
@1.4MHz typical：TBD
LTE-FDD B5 @200KHzbps typical：TBD
@1.4MHz typical：TBD
LTE-FDD B8 @200KHzbps typical：TBD
@1.4MHz typical：TBD
LTE-FDD B20 @200KHzbps typical：TBD
@1.4MHz typical：TBD
4.3 Working and storage temperature
The operating temperature and storage temperature of L710HG is listed in the following table.
Table 4-5 Operating temperature
Parameter
Min.
Typ.
Max.
Unit
Extended operation
temperature*
-40 25 85
℃
Storage temperature
-45 25 90
℃
*Note: Module is able to make and receive voice calls, data calls, SMS and make
GPRS/WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. Temperatures outside of the range -30℃ ~
+80℃ might slightly deviate from ETSI specifications.