Use Instructions

L710HG Hardware Design
3
3.9 Power on/off and reset interface ........................................................................................................... 30
3.9.1 Pin definition ......................................................... 30
3.9.2 Power on sequence ...................................................... 30
3.9.3 Power off sequence ..................................................... 31
3.9.4 Force PSM mode Out ..................................................... 32
3.9.5 Reset sequence ......................................................... 32
3.9.6 Power on/off and reset interface application ........................... 32
3.10 Interactive interface............................................................................................................................. 33
3.10.1 Pin definition ........................................................ 33
3.10.2 interactive interface application ..................................... 34
3.11 Net Light interface ............................................................................................................................... 34
3.11.1 Pin define ............................................................ 34
3.11.2 Net light application ................................................. 35
3.12 System boot configuration and download .......................................................................................... 36
3.12.1 Pin definition ........................................................ 36
3.12.2 Boot configuration and force USB interface application ................ 36
3.13 Analog and Digital conversion (ADC) interface ................................................................................ 37
3.14 I2C interface ......................................................................................................................................... 37
3.14.1 I2C pin definition .................................................... 37
3.15 SPI interface ...................................................................................................................................... 38
3.16 Antenna interface ................................................................................................................................. 39
3.16.1 RF signal PCB layout guide ............................................ 39
3.16.2 applications .......................................................... 39
3.16.3 Antenna Layout guideline .............................................. 40
4 PRODUCT CHARACTERISTICS ................................. 41
4.1 Absolute parameters .............................................................................................................................. 41
4.2 Operation condition ............................................................................................................................... 41
4.2.1 Operation voltage ...................................................... 41
4.2.2 Work mode .............................................................. 41
4.2.3 current consumption .................................................... 43
4.3 Working and storage temperature ....................................................................................................... 43
4.4 ESD performance .................................................................................................................................. 44
5 DESIGN GUIDELINE ........................................ 45
5.1 General design rules and requirements ............................................................................................... 45
5.2 Reference circuit .................................................................................................................................... 45
5.3 RF part design guideline ....................................................................................................................... 45
5.3.1 Early antenna design considerations ................................................................................................. 45
5.4 EMC and ESD design advice ................................................................................................................ 46
5.5 PCB Recommended land pattern ......................................................................................................... 46
5.6 Products recommended upgrade .......................................................................................................... 47